Wafer Thickness Distribution Measurement Device "TMS-2000"
Non-contact measurement of flatness with a repeatability of 1nm is possible!
The TMS-2000 is a super high-precision wafer thickness distribution measurement device with innovative hardware design and high resistance to environmental changes. It enables inline inspection of various wafer materials such as silicon (up to P+++), SiC, sapphire, glass, LiNb3, and SOI, allowing for a wide range of applications that take advantage of high throughput and compact size. It adopts a spiral scan method that balances high speed and high-density measurement. The compact design allows for space-saving placement. 【Features】 - Stable thickness measurement based on high resistance to environmental temperature changes and vibrations - Sub-nanometer repeat measurement accuracy - High flexibility in scanning methods to measure thickness distribution on the wafer surface - Measurement possible even when attached to jigs with light irradiation from one side - Differential analysis possible with multiple different wafers - Measurement of evaluation parameters compliant with SEMI standards *For more details, please download the PDF or feel free to contact us.
basic information
【Other Features】 ■ Compatible with high-doped Si, multi-layer wafers, and power device materials ■ High-precision measurement using optical heterodyne interference method (repeat measurement accuracy below 1nm) ■ High environmental resistance (utilizing Santec's proprietary patented technology) *For more details, please download the PDF or feel free to contact us.
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【Measurement Functions】 ■ Thickness Distribution Measurement - Comes with a dedicated measurement and analysis application - Allows for intuitive operation to perform measurement, analysis, and data output consistently ■ Flatness Measurement - Capable of flatness measurement (global, site, edge) in accordance with SEMI standards - Graphical display and output of statistical processing results are also possible ■ Residual Analysis - Analysis using Zernike polynomial approximation is also possible - Can be utilized for inspecting in-plane sag and surface scratches *For more details, please download the PDF or feel free to contact us.
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Santec has been manufacturing optical components, laser products, and optical measuring instruments for over 40 years, responding to the stringent quality demands of our customers in the optical industry. Additionally, by constantly seeking innovation and meeting customer requests, Santec has introduced numerous new optical-related products to the market. Our journey towards the creation of the ideal world of light, "OPTOPIA," which is our management philosophy, also involves minimizing the timeline from product concept to commercialization.