Exhibition at Automotive World 2025: [Heat Dissipation and Electromagnetic Shielding Resin Molding Products]

積水テクノ成型新事業開発部

Sekisui Techno Molding will exhibit at Automotive World 2025. Event Dates: January 22, 2025 (Wednesday) 10:00 AM - 5:00 PM January 23, 2025 (Thursday) 10:00 AM - 5:00 PM January 24, 2025 (Friday) 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall Booth Location: East Hall 4 E33-12 (within the Mie Prefecture booth) Exhibition Content: The exhibition will take place within a booth organized by Mie Prefecture. A total of 7 companies will exhibit within the same booth. Sekisui Techno Molding will showcase "heat dissipation and electromagnetic wave shielding resin molded products."

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Related product information

Thermal conduction molded products
Heat dissipation performance closer to metal materials than general-purpose resins! Proposing material and product design tailored to the quality requirements of various products.

For more details, please refer to the PDF document or feel free to contact us.
Injection-molded resin optimal for heat dissipation and EMC measures for various EV-related automotive components.
If it is a heat-dissipating and electromagnetic wave shielding resin molded product, EMC measures essential for e-Axle and on-board chargers (OBC) can also be achieved.

■Heat dissipation and electromagnetic wave shielding resin molded products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Lightweighting and cost reduction through the use of plastics around automotive ECUs [ECM measures].
Currently, metal housings/cases are mainstream for vehicle-mounted ECUs. By changing this to resin, weight reduction and cost savings can be achieved.

■Thermal Conductive Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Realization of high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Realization of high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Realization of electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Vehicle-mounted camera and millimeter-wave radar housings made of resin that can counter ECM measures.
Proposal for resin molded products that ensure heat dissipation and electromagnetic wave shielding performance for vehicle-mounted cameras, millimeter-wave radar, and LiDAR housings.

■Heat-conducting resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat dissipation and electromagnetic wave shielding resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Contributing to Sekisui's development products [heat dissipation, EMC, and weight reduction measures]!
Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.

■Thermal Conductive Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) - Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) - Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Promotional video [Heat dissipation and electromagnetic wave shielding resin molded products]
The video of the heat dissipation and electromagnetic wave shielding resin molded products has been completed.

■Thermal Conductive Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω