Contributing to Sekisui's development products [heat dissipation, EMC, and weight reduction measures]!
Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.
【People and Cars Technology Exhibition YOKOHAMA】 Date: May 21 to 23 Location: Pacifico Yokohama Exhibition Hall 351 (inside the Sekisui Chemical booth) Real resin samples will be on display, so please come and visit. With the electrification of automobiles, the challenge is to "lighten the body and extend the driving range," and the demand for lightweight materials is significantly increasing across the industry. Sekisui Techno Molding's approach contributes to weight reduction and cost savings by converting metal to resin. In cases of the same shape, this results in approximately 45% weight reduction compared to metal. While many resin products show a significant decrease in heat dissipation and are inferior in controlling electromagnetic waves (noise) compared to metal, Sekisui Techno Molding's resin products ensure these functions. - Heat Dissipation Focused Type - ■ Heat Conductive Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products - Heat Dissipation and Electromagnetic Wave Shielding Compatible Type - ■ Heat Dissipation and Electromagnetic Wave Shielding Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Electromagnetic wave shielding performance through conductivity - Weight reduction, improved design flexibility, and mass production by replacing metal products
basic information
■Thermal Conductive Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) - Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) - Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
Price range
Delivery Time
Model number/Brand name
- Heat-conducting resin molded products - Heat dissipation and electromagnetic wave shielding resin molded products
Applications/Examples of results
■Vehicle-mounted camera housing ■Millimeter-wave radar housing ■Meter cluster ■Heat dissipation fins ■Inverter cover, DC-DC converter cover ■OBC case ■e-Axle ■ADAS components ■AD components ■Shield plate ■Others, ECU case
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2025 Yokohama Automotive Technology Exhibition Participation
We will be exhibiting at the 2025 Automotive Technology Exhibition. We will showcase "Heat Dissipation and Electromagnetic Shielding Resin Molded Products." If you have time, we would be delighted if you could stop by our booth. We will provide explanations while you can touch the actual products. Please see below for details. 【2025 Automotive Technology Exhibition】 https://aee.expo-info.jsae.or.jp/ja/yokohama/ Exhibition Dates: May 21, 2025 (Wed) 10:00 AM - 6:00 PM May 22, 2025 (Thu) 10:00 AM - 6:00 PM May 23, 2025 (Fri) 9:00 AM - 4:00 PM Venue: Pacifico Yokohama Exhibition Hall, North Booth Location: Exhibition Hall 351 (within the Sekisui Chemical booth) *For exhibition and registration information, please visit here: https://aee.expo-info.jsae.or.jp/ja/registinfo/
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Exhibition at Automotive World 2025: [Heat Dissipation and Electromagnetic Shielding Resin Molding Products]
Sekisui Techno Molding will exhibit at Automotive World 2025. Event Dates: January 22, 2025 (Wednesday) 10:00 AM - 5:00 PM January 23, 2025 (Thursday) 10:00 AM - 5:00 PM January 24, 2025 (Friday) 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall Booth Location: East Hall 4 E33-12 (within the Mie Prefecture booth) Exhibition Content: The exhibition will take place within a booth organized by Mie Prefecture. A total of 7 companies will exhibit within the same booth. Sekisui Techno Molding will showcase "heat dissipation and electromagnetic wave shielding resin molded products."
