積水テクノ成型 新事業開発部 Official site

Promotional video [Heat dissipation and electromagnetic wave shielding resin molded products]

The video of the heat dissipation and electromagnetic wave shielding resin molded products has been completed.

This is a PR video for Sekisui's developed products: thermal conductive resin molded products and heat dissipation/electromagnetic wave shielding resin molded products.

Related Link - https://www.sekisui-techno-new-product.co.jp/

basic information

■Thermal Conductive Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω

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Applications/Examples of results

■Vehicle-mounted camera housing ■Millimeter-wave radar housing ■Meter cluster ■Heat dissipation fins ■Inverter cover, DCDC converter cover ■OBC case ■e-Axle ■ADAS components ■AD components ■Shield plate ■Others, ECU case

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