積水テクノ成型 新事業開発部 Official site

Vehicle-mounted camera and millimeter-wave radar housings made of resin that can counter ECM measures.

Proposal for resin molded products that ensure heat dissipation and electromagnetic wave shielding performance for vehicle-mounted cameras, millimeter-wave radar, and LiDAR housings.

Recently, the technologies of "Advanced Driver Assistance Systems (ADAS)" and "Autonomous Driving (AD)" have been steadily evolving. To ensure the stable operation of key technologies and important safety components such as "onboard cameras," "LiDAR," and "millimeter-wave radar," EMC (Electromagnetic Compatibility) measures have become a significant challenge. Sekisui Techno Molding's approach enables many resin products, which are inferior to metals in terms of heat dissipation and electromagnetic wave (noise) control, to achieve weight reduction and design flexibility through resin molding while ensuring these functionalities, leading to cost reductions through mass production. ■ Heat-conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise through heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity enhancement - Weight reduction, improved design flexibility, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from planning and prototype development/verification to mass production and sales to realize their ideals.

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basic information

■Heat-conducting resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) ・Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat dissipation and electromagnetic wave shielding resin molded products ・Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) ・Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω

Price range

Delivery Time

Model number/Brand name

- Heat-conducting resin molded products - Heat dissipation and electromagnetic wave shielding resin molded products

Applications/Examples of results

■Vehicle-mounted camera housing ■Millimeter-wave radar housing ■Meter cluster ■Heat dissipation fins ■Inverter cover, DCDC converter cover ■OBC case ■e-Axle ■ADAS components ■AD components ■Shield plate ■Others, ECU case

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