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What is 5μm round hole microfabrication technology? An explanation comparing it with conventional micro hole processing!

セムテックエンジニアリング

セムテックエンジニアリング

Our Super Micro Sieve (particle sieve) is produced using electroforming technology. This document summarizes the differences between the "Super Micro Sieve technology," which achieves highly precise fine hole processing, and conventional methods such as etching, laser, drilling, milling, and electrical discharge machining. Additionally, "processing examples" are included with photographs. You can find more detailed information in related products and catalogs.

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  • What is 5μm round hole microfabrication technology? An explanation comparing it with conventional microhole processing is underway!

    A "sieve" used for sorting fine particles used in devices such as LCD TVs and smartphones. A technology that achieves high durability and high precision fine processing with an aspect ratio of 10 times!

    Q: What is electroforming technology? A: It is a technology that combines semiconductor technology and electroplating technology to create products with fine structures. Our company manufactures fine products by using pillars refined through exposure to photosensitive resin via pattern molding and performing nickel plating. Q: What is aspect ratio? A: In microfabrication, it represents the relationship between the dimensions of a hole or groove width and the thickness of the product. The aspect ratio is calculated as plate thickness ÷ hole diameter, and the larger this value, the more robust it becomes. *For more details, please refer to the PDF document or feel free to contact us.

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