• 1. Notable Technology Information(4)

  1. Semtech Engineering contributes to society through "original technology development." - The first is fine processing that surpasses the technical limits through "electroforming technology." We have established manufacturing technology that achieves high precision, high strength, high open area ratio, and ultra-high aspect ratio (thickness ÷ hole diameter) all at once. This contributes to the commercialization of highly reliable products (we also accept product orders). * Example of super micro sieves (screens) for narrow pitch products (hole diameter + 10μm) 【 Minimum hole diameter φ5μm ・ thickness 50μm 】 ・ 【 Hole diameter φ10μm ・ maximum thickness 100μm 】 - The second is an example of the adoption of super micro sieves, which establishes cutting-edge classification technology that completely removes coarse particles at the level of individual counts, exceeding the hole diameter (please refer to the classification technology introduction). The S-150W is a humidity-based classification device with a minimum hole diameter of 5μm and a thickness of 50μm.

• 2. Introduction to Basic Techniques(4)

  2. Prominent Technology for Microfabrication: Electroforming Technology - The method called electroforming is a special technology that combines semiconductor manufacturing techniques with electroplating, allowing for the processing of 'microstructures' that cannot be achieved with other methods. - A significant feature of our company is that we have established manufacturing technology that provides products with 'ultra-high aspect ratios' of over 10, surpassing the typical aspect ratio limit of around 1 to 2. - Furthermore, the hardness is very high, ranging from HV550 to 600, resulting in exceptional reliability of the products.

• 3. Examples of Microfabrication(7)

  3. Features of Electroforming Technology ... ≪Leveraging Expertise for Product Development≫ - One of the features of electroforming technology is the ability to freely create "fine and arbitrary shapes" through the design of the patterns on the photomask used in the exposure process (refer to the irregular hole materials). - Semtech Engineering has also established innovative technology for producing ultra-high aspect ratio fine irregular holes. - Focused on narrow pitch and hardness of HV550-600 ⇒ Product development for high voltage applications is also possible. - This technology has very high hole diameter and pitch accuracy ⇒ Enabling the development of various applications.

• 4. Case Studies(11)

  4. Super high-reliability super micro sieves used for classifying functional particles (to standardize particle size) - In the technological innovations that have enabled ultra-high-definition for 4K and 8K LCD TVs, computers, smartphones, etc., "fine particles known as functional particles" are adopted in two critical areas. - These include "spacer particles" used to narrow and uniform the gap between two glass panels in LCD displays, and "anisotropic conductive particles" with gold plating on their surfaces used for connecting high-density circuits. - The specifications for these particles are extremely strict, allowing for no more than one out-of-spec particle in every ten billion. - Our super high-reliability "sieve," the super micro sieve, is adopted by many companies to standardize the particle size of functional particles.

• 5. Application Examples(4)

  5. Features of Electrofoming Technology... ≪For Next-Generation Product Development≫ - The advantage of this technology is that it allows for the creation of arbitrary hole shapes through the design of the photomask used during exposure, focusing on Semtech Engineering's innovative technology. - 'Arbitrary hole shapes' + 'Narrow pitch' + 'Ultra-high aspect ratio' + 'Hardness HV600' + 'High voltage resistance' This was thought to be impossible with conventional processing technologies ⇒ Possibility of 'Revolutionary product development'... Great - Such advancements also challenge the dream of ultra-high-density spinning with [non-circular cross-section fibers], making previously unimagined concepts possible... Research on next-generation imaging technologies to replace X-rays, centered around universities, also contributes to developments in the medical field.

• 6. Introduction to Grading Technology(4)

  6. Mastering Ultimate Classification Technology: Complete Removal of Coarse Particles Not Reflected in Particle Size Distribution - In recent years, the development of fine particles and their applications has rapidly expanded, with many companies exploring new business opportunities related to material types, particle sizes, and shapes (as observed at the Powder Technology Exhibition). - While very sharp particle size distributions are required for certain applications, completely removing coarse particles that are mixed during the manufacturing process and meeting stringent specifications is an extremely challenging task. - Semtech Engineering has developed a super high aspect ratio, ultra-reliable "sieve" Challenging particle size classification technology for particles below 5 μm using the "Super Micro Sieve." - With a minimum hole diameter of 5 μm, we have successfully achieved complete removal of coarse particles larger than 5 μm mixed during the manufacturing process at the PPB level. We have also succeeded in developing a mass production wet classification device, S-150W.

Product/Service List (53)