All products and services
1~30 item / All 53 items
-
Grading Technology: After grading, image analysis of on-spec particles - 'Caution: Coarse Particles'
Verification of classification accuracy using the wet classification device S-100W-D. Image analysis of the particle size of the on-spec particles collected on the screen after classification.
last updated
-
[Grading Technology] After grading, pass product particle image analysis
Classification accuracy verification using the wet classification device S-100W-D. Removal of coarse particles at the individual level. Measurement of the particle diameter of the passed product.
last updated
-
Grading Technology: Image Analysis of Pre-Graded Particles by FPIA-3000
Classification accuracy confirmation using the wet classification device S-100W-D: removal of coarse particles at the individual level; pre-measurement of experimental particles.
last updated
-
Grading Technology: What is High Reliability Grading? Grading Examples
Semtech Engineering's "classification technology" removes trace amounts of coarse particles at the "particle count level" that are not represented in the particle size distribution.
last updated
-
[Original Technology] Sieve Reliability Test Drop Experiment
What is a high-reliability sieve "Super Micro Sieve"? Quality verification through rigorous testing.
last updated
-
[Original Technology] Super Micro Sieve Strength Test
The important factor in screening is the strength of the sieve; damage to the sieve has a significant impact on the product, so quality is verified through rigorous testing.
last updated
-
【Original Technology】 Fine Screen Comparison Table by Structure
The sieves used for the classification of fine particles vary in accuracy depending on their structure, so it is necessary to use them selectively according to the purpose.
last updated
-
[Original Technology] Ultra High Reliability Sieve Super Micro Sieve
This sieve processes high-precision fine holes using a method called electroforming, which combines semiconductor manufacturing technology and electroplating.
last updated
-
[Original Technology] Wet Classification Device S-100W-D Device Configuration
High Reliability Screen ≪Super Micro Sieve≫ Equipped - Ultimate Classification Device that Does Not Clog (Details Not Disclosed)
last updated
-
[Original Technology] Ultra High Reliability Wet Classification Device S-100W-D
Removal of undetected coarse particles at the particle count level without clogging, enabling high-speed classification and improved processing capacity.
last updated
-
3-2【Original Technology】Wet Classification Device S-100W-D Device Configuration
High Reliability Screen ≪Super Micro Sieve≫ Equipped Ultimate classification device that does not clog (Details not disclosed)
last updated
-
[Grading Technology] Wet Classification Device S-100W-D High Reliability Classification Case Study
Semtech Engineering's classification technology removes coarse particles that are not represented in the particle size distribution at the count level.
last updated
-
4-3 【Original Technology】 Super Micro Sieve Strength Test
The important factor in screening is the strength of the screen. Since screen damage can have a significant impact on the product, we verify quality through rigorous testing.
last updated
-
Mastering the ultimate classification technology, contributing to society with the S-100W-D【Innovative Technology】.
Complete removal of coarse particles at the "particle count level"! Classification of φ5μm particles with a recovery rate of over 95% 【Contract classification available】
last updated
-
Electroforming technology *Mastering classification technology
Remove coarse particles and out-of-spec particles mixed in the particle manufacturing process! The essential 'sieve' for classification is solved with Semtech Engineering's unique technology.
last updated
-
A sturdy nickel sieve with a minimum hole diameter of 5μm is possible!
High strength and tear-resistant, usable for semi-permanent! A sturdy nickel sieve with a thickness of 50μm to 100μm can be produced.
last updated
-
Super High Reliability "Sieve" [Super Micro Sieve] *Original Technology Case
Introducing the innovative technology developed by Semtech Engineering. Adopted in ultra-high-definition innovations for 4K and 8K LCD TVs, computers, smartphones, and more.
last updated
-
Contributing to society with original technology.
We are engaged in ultra-fine processing using electroforming technology.
last updated
-
2-1 Introduction to Ultra High Reliability Super Micro Sieve
Challenging the limits of technology: High precision micro hole processing ≪The amazing technique of electroforming≫
last updated
-
What is 5μm round hole microfabrication technology? An explanation comparing it with conventional microhole processing is underway!
A "sieve" used for sorting fine particles used in devices such as LCD TVs and smartphones. A technology that achieves high durability and high precision fine processing with an aspect ratio of 10 times!
last updated
-
High-precision particle classification sieve
High Value-Added Fine Particle Development" and "Highest Quality Particle Manufacturing" The key lies in the "Sieve" - "Super Micro Sieve.
last updated
-
What is the 5-micron round hole microfabrication technology of Super Micro Sieve?
Unlike conventional micro-hole processing methods, Semtech Engineering's unique technology enables classification with a minimum of 5μm using electroforming technology.
last updated
-
[Ultra-Fine Processing] Super Micro Sieve Technology * Comparison Table of Methods & Introduction of Processing Examples
Established ultra-fine processing technology with a hole diameter of 5μm, pitch of 15μm, plate thickness of 50μm, and an ultra-high aspect ratio (plate thickness ÷ hole diameter)! *Introducing freely customizable non-circular hole processing.
last updated
-
Super High Reliability "Sieve" [Super Micro Sieve] *Original Technology Case
Introducing the innovative technology developed by Semtech Engineering. Adopted in ultra-high-definition innovations for 4K and 8K LCD TVs, computers, smartphones, and more.
last updated
-
1-3 What is Electroforming (EF) technology?
It is a technology that combines semiconductor manufacturing techniques and electroplating to process high-precision fine holes.
last updated
-
1-4 Resin pillar scanning electron microscope (SEM) images
When a mask is overlaid and exposed on the substrate, resin pillars are formed, and when plated, holes with inverted shapes are created.
last updated
-
1-2 Comparison of Microhole Construction Methods
Methods and Technical Limitations of Micro-Hole Machining
last updated
-
3-0 Micro Hole Shape Processing Example Introduction 1
Features of electroforming technology... ≪Leveraging expertise for product development≫
last updated
-
3-1 Micro Hole Shape Processing Example Introduction 2
Features of electroforming technology... ≪Leveraging expertise for product development≫
last updated
-
3-2 Round Hole
Prototype example: high aspect ratio round hole
last updated