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We will be exhibiting at the 34th NePCON Japan - Electronics Development and Implementation Exhibition - from January 15 to 17, 2020.

神港精機

神港精機 東京支店

Shinko Precision Co., Ltd. will be exhibiting at the 34th Nepcon Japan - Electronics Development and Implementation Exhibition - held at Tokyo Big Sight. We will showcase the actual machine of our renewed vacuum reflow device. You will be able to experience the upgraded equipment live. Additionally, we plan to display panels for our ICP etching equipment compatible with next-generation devices such as SiC and GaN, as well as a heat treatment device compatible with reducing atmosphere for next-generation bonding materials. We sincerely look forward to your visit. 【Exhibited Products】 ■ Plasma Cleaning Device "POEM" (Plasma Cleaner) ■ Inline Vacuum Soldering Device ■ Batch Vacuum Soldering Device (Fluxless Reflow Vacuum Reflow)

  • Date and time Wednesday, Jan 15, 2020 ～ Friday, Jan 17, 2020
    10:00 AM ～ 06:00 PM
    Only on the final day until 5 PM.
  • Capital ■Venue: Tokyo Big Sight ■Address: 3-11-1 Ariake, Koto City, Tokyo ■Access 　・About a 7-minute walk from "Kokusai Tenjijo Station" on the Rinkai Line 　・About a 3-minute walk from "Tokyo Big Sight Station" on the Yurikamome Line ■Booth Number: South Exhibition Hall S8-15
  • Entry fee Free If you do not have an invitation ticket, the admission fee is 5,000 yen per person.

Related product information

  • Plasma cleaning device "POEM" (plasma cleaner)

    Multi-functional plasma cleaning device. Sample testing currently accepted. Suitable for cleaning and hydrophilization, improving solder wettability, and optimal for pre-treatment before mounting.

    A vacuum plasma device equipped with an electrode switching mechanism and multiple gas systems in a compact housing, offering significant effects. The lineup ranges from a small type for φ230 processing to a large type compatible with 500mm square (φ600mm). The automatic transport mechanism is individually designed to match substrate dimensions, production line configuration, and production volume, supporting line automation and high throughput. With extensive experience in individual process development through cleaning, hydrophilic treatment, ashing, light etching, hydrophobic treatment, and sample testing.

  • Batch-type vacuum soldering device (fluxless reflow vacuum reflow)

    Achieving fluxless, voidless reflow from power modules to wafer bumps. New model launched for upgraded quality! *Currently supporting sample testing.

    Achieving fluxless reflow through a combination of vacuum exhaust and a reducing atmosphere, realizing void-free results with a suitable pressure profile tailored to solder and substrates. A compact batch-type device form that achieves energy savings in gas and electricity. Short cycle processing is realized, including startup, processing, and maintenance. Extensive track record not only in soldering power modules but also in various bonding processes such as wafer bump reflow, repair, and MEMS device encapsulation. Proven results and flexible, proactive prototyping support in nano metal paste sintering bonding processes. 【Exhibition Overview】<NEPCON Japan 2020> Exhibition: 34th NEPCON Japan - Electronics Development and Packaging Exhibition Date: January 15 (Wed) - 17 (Fri) Venue: Tokyo Big Sight Booth: South Exhibition Hall S8-15

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