Batch-type vacuum soldering device (fluxless reflow vacuum reflow)
Achieving fluxless, voidless reflow from power modules to wafer bumps. New model launched for upgraded quality! *Currently supporting sample testing.
Batch-type vacuum soldering equipment that achieves high-reliability soldering. High-speed and uniform soldering in a low-oxygen atmosphere through vacuum evacuation. Achieves a high level of void-free soldering through combinations of vacuum, atmospheric pressure, and various atmospheres (reduction, inert). A basic model of the standard process for high-reliability power modules for automotive applications. A new model has been introduced to increase processing capacity and performance. The new model has been installed at the factory. Actively responding to equipment tours and sample tests. Conducting void-free, flux-free soldering tests, including plasma cleaning for pre-treatment. ★ We will exhibit at NEPCON Japan 2020! * For more details, please refer to the PDF document or feel free to contact us.
basic information
Achieving fluxless reflow through a combination of vacuum exhaust and a reducing atmosphere, realizing void-free results with a suitable pressure profile tailored to solder and substrates. A compact batch-type device form that achieves energy savings in gas and electricity. Short cycle processing is realized, including startup, processing, and maintenance. Extensive track record not only in soldering power modules but also in various bonding processes such as wafer bump reflow, repair, and MEMS device encapsulation. Proven results and flexible, proactive prototyping support in nano metal paste sintering bonding processes. 【Exhibition Overview】<NEPCON Japan 2020> Exhibition: 34th NEPCON Japan - Electronics Development and Packaging Exhibition Date: January 15 (Wed) - 17 (Fri) Venue: Tokyo Big Sight Booth: South Exhibition Hall S8-15
Price information
Please feel free to contact us.
Delivery Time
Applications/Examples of results
Power semiconductor module soldering Power semiconductor module metal nanopaste sintering bonding MEMS device encapsulation Wafer bump reflow Repair process after solder reflow
