Multi-purpose sputtering device

Support from research and development to mass production!

最終更新日 Jan 20, 2020

Vacuum deposition equipment for wafer processes

Achieves a film formation mechanism with excellent film thickness uniformity and high-speed exhaust! Capable of stably forming high-quality electrode films.

最終更新日 Jun 24, 2019

Research and development vacuum deposition device

Flexible response according to purpose and cost! For universities, public research institutions, and basic experiments.

最終更新日 Jun 17, 2019

Liftoff process compatible vacuum deposition equipment

This is a dedicated deposition device designed for the lift process commonly used in high-frequency communication devices.

最終更新日 Jun 24, 2019

Annealing device "Variable Atmosphere Heat Treatment Device"

Capable of processing various substrates such as wafers and glass; a variable atmosphere heat treatment device compatible with a wide range of applications (supports sample testing in O2 or H2 atmosphere annealing).

最終更新日 Dec 16, 2019

Roll-to-roll plasma processing device (RtoR plasma device evaluation tests now accepting applications)

We have a proven track record in the transportation and processing of fibers, accommodating a wide range of applications from electronics to advanced materials!

最終更新日 May 26, 2020

Hydrogen annealing device (for electronic devices, currently supporting sample testing)

Uniform heating in atmospheric pressure hydrogen atmosphere. Providing flexible hard support and sample testing with abundant experience and track record for thin films, wafers, compound, and ceramic substrates.

最終更新日 Apr 30, 2020

Demonstration of the load lock type sputtering device (single wafer transport type) is currently in progress.

From discrete components to advanced devices, from R&D to mass production. A compact, high-quality, multi-purpose CtoC type sputtering system.

最終更新日 May 13, 2020

AlN template creation device (sputtering device for oriented AlN films)

AlN templates for UV-LEDs using sputtering. AlN films with high crystallinity and C-axis orientation can be created by sputtering. Latest model deposition equipment.

最終更新日 Apr 28, 2020

Vacuum exhaust device (vacuum pump unit)

Exhaust system unit with proven performance and reliability. Designed to handle applications that are difficult with a single pump. Enhanced reliability with combinations tailored to the purpose and additional peripheral equipment.

最終更新日 Aug 20, 2024

Multi-chamber sputtering device

A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.

最終更新日 May 08, 2020

Hard film sputtering device STL5521 type (for precision lens molds)

Multi-layer film deposition using a maximum of 5 yuan cathodes. Wear resistance, heat resistance, and smooth thin films. High throughput even for high-temperature deposition with a load lock type.

最終更新日 May 26, 2020

Vacuum heat treatment device (hot plate type)

A compact heat treatment device characterized by rapid temperature rise and fall. It is an ideal compact vacuum heat treatment device for low-temperature heat treatment such as drying, degassing, and baking of organic substrates.

最終更新日 May 19, 2020

Vacuum exhaust system for CVD equipment (chlorine gas compatible vacuum pump unit)

Proven track record in exhaust for hot CVD equipment. Particularly effective for the exhaust of Cl-based gases, achieving both high-volume exhaust and compatibility with chlorine-based gases. A reliable system that also incorporates gas treatment.

最終更新日 Jun 15, 2020

Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)

A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid cooling mechanism. It is also compatible with transparent electrode films.

最終更新日 Feb 20, 2023

SiC coating device (AF-IP device)

A dense SiC (silicon carbide) film with excellent wear resistance and oxidation resistance is formed using PVD. A thick film (7 μm) is formed using a new ion plating method.

最終更新日 Jun 22, 2020

Horizontal hydrogen annealing device (variable atmosphere heat treatment device)

Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).

最終更新日 Feb 20, 2023

Ion plating device for side electrodes (compatible with surface-mounted small components)

Dry formation of side electrodes for small electronic components (surface mount type). End face electrode deposition compatible with small components made possible by PVD (ion plating equipment).

最終更新日 Sep 03, 2020

Hydrogen-free DLC coating device (high-density sputtering ADMS device)

Forming hydrogen-free DLC films (hydrogen content below 1%) with unique technology, exhibiting excellent tribological properties in oil, and compatible with conductive carbon thin films.

最終更新日 Dec 13, 2021