Annealing device "Variable Atmosphere Heat Treatment Device"
Capable of processing various substrates such as wafers and glass; a variable atmosphere heat treatment device compatible with a wide range of applications (supports sample testing in O2 or H2 atmosphere annealing).
We offer a rapid temperature rise and fall type "horizontal annealing device" that can be processed in vacuum, oxygen atmosphere (at atmospheric pressure), and reducing atmosphere (at atmospheric pressure). It is capable of processing various substrates (wafers, ceramics, glass, mounted substrates) up to 6 inches, and has a proven track record in applications such as annealing of thin films and wafers, firing of nano metal pastes, and curing of organic materials. For those who wish to evaluate our equipment, we offer sample testing. Please contact us for details on specifications and available test contents. 【Features】 ■ Uniform heating treatment in various atmospheres (vacuum, N2, O2, H2) (up to 900°C) ■ Rapid cooling through the movement of the heating furnace body ■ Processing in a clean atmosphere using quartz tubes ■ Wide range of application support *For more details, please feel free to contact us.
basic information
For more details, please feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Thin film annealing = High melting point metal film annealing, electrode/wiring film annealing, alloying ■ Wafer heat treatment = LT wafer resistivity control annealing, Si wafer H2 annealing ■ Sintering of bonding materials = Power device module bonding process ■ Polyimide cure = High-density mounting substrate wafer-level package *For more details, please feel free to contact us.
