Vacuum deposition equipment for wafer processes
Achieves a film formation mechanism with excellent film thickness uniformity and high-speed exhaust! Capable of stably forming high-quality electrode films.
The "Vacuum Deposition Device for Wafer Processes" is a batch-type deposition device designed for forming electrode films on wafers up to 6 inches in size. It has a wealth of experience in mass production applications for discrete ICs, compound ICs, and MEMS devices. The device can stably form high-quality electrode films due to its film formation mechanism, which excels in film thickness uniformity, and an oil-free exhaust system that enables rapid evacuation. It boasts a high operational rate as a deposition device for mass production applications. 【Features】 ■ Highly reliable basic configuration ■ Abundant optional mechanisms - Evaporation sources, multi-beam electron guns (10kW), resistance heating evaporation sources, multi-source simultaneous deposition mechanisms - High-temperature heating (up to 550°C) = three-sided planetary dome - Substrate cleaning, ion guns, RF bombardment mechanisms - Substrate dome, three-sided planetary dome, revolution dome, high-temperature heating revolution dome *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Other Features】 - Abundant selection mechanisms such as substrate domes designed for handling thin wafers after polishing and high-temperature heating functions that allow for alloying of electrode films simultaneously with film formation. - Capable of responding meticulously to a variety of requests. *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■Vacuum deposition for wafer processes *For more details, please refer to the PDF document or feel free to contact us.
