Hydrogen annealing device (for electronic devices, currently supporting sample testing)
Uniform heating in atmospheric pressure hydrogen atmosphere. Providing flexible hard support and sample testing with abundant experience and track record for thin films, wafers, compound, and ceramic substrates.
Maximizing the reducing power of hydrogen to achieve high-quality thin films and substrate surfaces that are unprecedented. Ideal for thermal processing (bake and anneal) of delicate compound devices and dielectric substrates. High reliability supported by proven results and experience ensures safety. Responding from the initial stage, including testing, based on extensive achievements in enhancing the quality of electrodes and wiring films, controlling the resistance and stress of high melting point metal films, and end processing of polished wafers for special applications.
basic information
The standard is a horizontal furnace with a quartz tube compatible with 6-inch wafers, with options for 8-inch and vertical furnaces. A high vacuum exhaust system can also be equipped, allowing for heat treatment in a more pure reducing atmosphere. In addition to a proven equipment configuration, there is a rich lineup of peripheral devices such as boat loaders and data logging mechanisms. There is also a dedicated annealing device that can accommodate inert atmosphere annealing.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
Semiconductor - Wafer thermal treatment after polishing - Electrode film sintering - High melting point metal film annealing - Compound semiconductor bake SAW device - Dielectric wafer annealing Flexible device - Metal wiring pattern firing Small metal parts reduction annealing
Line up（1）
| Model number | overview |
|---|---|
| Variable Atmosphere Heat Treatment Device |
