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Hard film sputtering device STL5521 type (for precision lens molds)

Multi-layer film deposition using a maximum of 5 yuan cathodes. Wear resistance, heat resistance, and smooth thin films. High throughput even for high-temperature deposition with a load lock type.

Ideal for forming high heat-resistant wear-resistant films necessary for the coating of precision lens molds. Precious metal alloys such as Pt and Ru suitable for lens mold coatings are efficiently formed using a multi-target simultaneous sputtering method with a small-diameter cathode. Additionally, films with excellent heat resistance and hardness can also be formed using a nano-multilayer structure. A special substrate holder that can rapidly heat substrates like precision lens molds, along with a dedicated load-lock mechanism, achieves improved throughput.

basic information

Equipped with a maximum 5 kW sword, this dedicated sputtering chamber allows for simultaneous sputtering of 5 kW and is suitable for transporting heavy substrates with a load lock mechanism, enabling mold coating. It features a special substrate holder that combines 650°C heating with gas cooling. This ensures strong adhesion of the film due to high-temperature heating and accelerates the processing speed. It is a dedicated load lock type sputtering device for hard films that can achieve optimal film types, processing temperatures, and processes for a wide range of materials and shapes.

Price information

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Delivery Time

Model number/Brand name

STL 5521 type

Applications/Examples of results

Precision lens mold coating

Hard film sputtering device STL5521 type

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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.