Multi-purpose sputtering device
Support from research and development to mass production!
basic information
【Features】 ● Capable of forming a wide range of materials and reactive thin films, including metals, alloys, and insulating films. ● High-speed film formation with substrate fixation and large-area film formation with substrate rotation are possible. ● Improved operability through a touch panel and easy data management with a logging system. 【Various Selection Functions】 ● Cathode change (large cathode configuration, 4-inch cathode diversification) ● High-temperature heating mechanism (800°C) ● Bias sputtering mechanism 【Product Lineup】 ● Load-lock sputtering equipment ● Multi-chamber sputtering equipment ● Ultra-high vacuum compatible single-wafer sputtering equipment ● Side sputtering equipment ● Carousel-type sputtering equipment ● Roll-to-roll sputtering equipment
Price information
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Delivery Time
Model number/Brand name
SRV Series
Applications/Examples of results
■Semiconductor Field■ Electrodes, wiring, and insulating layers for ICs and hybrid ICs ■Electronic Components Field■ Josephson junctions, solar cells, optoelectronics ■Display Devices Field■ LCD, EL, LED, PDP, FED ■Magnetic Recording Field■ Magnetic heads, magnetic disks, optical disks ■Optical Field■ Lenses, mirrors, filters ■Surface Treatment Field■ Decorative, lubricating, and corrosion-resistant surface treatments
