Multi-chamber sputtering device
A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.
Actively responding to various applications and substrates that are difficult to accommodate with standard specifications. Dedicated mechanisms are prepared for many substrates, including R&D, discrete components, compounds, MEMS, packaging, assembly processes, masks, and small FPDs. Tray transport of substrates is also standard, enabling film deposition and processing of different types of substrates on the same device through atmospheric substrate handling. In addition to application-specific cathodes (wide erosion, ferromagnetic materials, oxides, reactive types), we support a wide range of applications with special substrate mechanisms (high-temperature heating, magnetic field application, cooling, etc.). Dedicated devices are individually designed based on process tests using in-house demonstration machines.
basic information
Cluster-type sputtering equipment centered around a transfer chamber. Standard support for both bare substrates and trays (susceptors). Actively compatible with a wide range of substrates including rectangular, small diameter, and irregular shapes. Supports up to 8-inch and equivalent rectangular substrates. Two standard models: hexagonal type and quadrilateral type. Achieves semiconductor-level performance and cleanliness for applications beyond semiconductors. Sputtering equipment for next-generation development.
Price information
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Delivery Time
Model number/Brand name
STM Series
Applications/Examples of results
Semiconductor research and development, prototyping Mass production of electronic devices (MEMS, SAW devices, high-frequency devices) Compound semiconductor research and mass production Semiconductor packaging (UBM formation) Prototyping and mass production of high-density mounting substrates Development and prototyping of small-sized FPDs
Line up（1）
| Model number | overview |
|---|---|
| Single-Sheet Sputtering Equipment STL Series | Adopts the process chamber of the multi-chamber sputtering equipment STM series. Equipped with dedicated cathodes and mechanisms tailored to specific applications. Provides advanced film deposition processes with a simple structure. |
