Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)
A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid cooling mechanism. It is also compatible with transparent electrode films.
Customizing an annealing device with extensive experience in Si processes for compound semiconductor processes. Capable of high temperatures (900-1000°C) compared to hot plate types for GaAs. Proven results in the alloying of electrodes for nitride semiconductor films. Equipped with a rapid temperature rise and fall heating furnace to control the annealing of electrode films with uniform heating and optimal temperature profiles. A heat treatment device for wafer processes with a proven track record that can propose optimal equipment configurations based on production volume and processes.
basic information
The horizontal quartz tube type is standard and supports heating in the range of approximately 400 to 1000°C. We offer two models: a vertical type (with automatic wafer transport mechanism) suitable for mass production of 4 to 6-inch wafers, and a horizontal type for wafers smaller than 4 inches. Depending on the purpose, it is possible to equip the heating furnace body with an opening and closing mechanism and a rapid cooling air fan, and we have a wide range of options including a high vacuum exhaust system, O2 gas system, and APC mechanism. Processing in vacuum and inert atmospheres is standard, and we can also accommodate processing in a reducing atmosphere as an option. In addition to annealing electrode films, high-temperature reduction heat treatment of semiconductor films and crystalline films is possible through atmospheric hydrogen treatment after high vacuum exhaust. To ensure temperature uniformity and facilitate handling of substrates, we provide detailed support such as temperature uniformity plates and dedicated jigs tailored to the substrate.
Price information
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Applications/Examples of results
Compound semiconductor electrode film annealing LED transparent electrode film annealing Oxide film coating material oxide film firing Polyimide cure/bake
