Vacuum soldering device (vacuum reflow device)

The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>

last updated Dec 26, 2022

Vacuum heat treatment device (hot plate type)

A compact heat treatment device characterized by rapid temperature rise and fall. It is an ideal compact vacuum heat treatment device for low-temperature heat treatment such as drying, degassing, and baking of organic substrates.

last updated May 19, 2020

Horizontal hydrogen annealing device (variable atmosphere heat treatment device)

Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).

last updated Feb 20, 2023

Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)

A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.

last updated Sep 03, 2020

Vacuum soldering device (vacuum reflow device)

Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>

last updated Dec 27, 2022

[Sintering Material Compatible] Vacuum and Reduction Sintering Furnace <Maximum 615×615mm>

Large substrate-compatible vacuum and reducing atmosphere sintering furnace │ Capable of multi-purpose processing such as soldering, sintering bonding, and Cu via firing.

last updated May 27, 2026