Assembly device
Assembly device
It is an assembly device that meets a wide range of needs.
1~6 item / All 6 items
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Vacuum soldering device (vacuum reflow device)
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
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Vacuum heat treatment device (hot plate type)
A compact heat treatment device characterized by rapid temperature rise and fall. It is an ideal compact vacuum heat treatment device for low-temperature heat treatment such as drying, degassing, and baking of organic substrates.
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Horizontal hydrogen annealing device (variable atmosphere heat treatment device)
Supports small-diameter wafers (4 inches) and niche processes for compound semiconductors. Compatible with both crystal processes and wafer processes (alloying and electrode annealing).
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Hydrogen atmosphere conveyor furnace (reduction atmosphere continuous heat treatment device)
A bestselling type with a wealth of achievements, supporting high-temperature soldering, paste sintering, and metal particle sintering processes with reliable software and highly dependable hardware.
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Vacuum soldering device (vacuum reflow device)
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
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[Sintering Material Compatible] Vacuum and Reduction Sintering Furnace <Maximum 615×615mm>
Large substrate-compatible vacuum and reducing atmosphere sintering furnace │ Capable of multi-purpose processing such as soldering, sintering bonding, and Cu via firing.
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