[Data] Removal of polymer residue after dry etching from the wafer.
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This document is a technical material proposing the "perc" process. Anisotropic dry etching is performed while forming a protective film, such as a polymer, to protect the sidewalls. Traditionally, cleaning has been done using dedicated organic solvent-based cleaning solutions, but this practice has started to be avoided due to safety and environmental concerns. 【Contents】 ■ Introduction ■ Process Overview ■ "perc" Cleaning Performance ■ Application to Plasma Dicing ■ Conclusion *For more details, please download the PDF or feel free to contact us.
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Siconnex, headquartered in Europe, is a global manufacturer of wet process equipment for the semiconductor industry and related fields. We provide batch spray equipment for wet etching, cleaning, and resist stripping for a wide range of end products, including MEMS, power semiconductors, analog/mixed-signal semiconductors, and III-V semiconductors. Our equipment sets industry standards with safety, automation, compact footprint, high throughput, and efficient use of economic resources. There is a growing demand for our solutions as follows: - Environmentally friendly: cleaning and resist stripping with ozone - Optimal for small quantities and diverse processes with a small footprint - Automatic detection of etching end points with EPD - Efficient equipment that reduces chemical consumption