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[Case Study] Seiko Instruments' Internal Grinding Machine Solves Challenges for Small Components

Introducing a case where the adoption of a high-frequency spindle resolved difficulties in ensuring precision.

We would like to introduce a case where Seiko Instruments Inc. resolved challenges through test processing. For small parts, such as components for medical devices, where coaxiality between the inner and outer diameters is required, it is generally difficult to ensure precision using commonly employed tool clamping methods like air chucks, diaphragm chucks, and magnetic chucks. Our internal grinding machine addresses these challenges by adopting a roll spindle mechanism used in bearing processing and our self-developed high-frequency spindle. [Case Overview] ■ Issues - Difficulty in ensuring precision for small parts requiring coaxiality between the inner and outer diameters. ■ Results - Achieved automatic supply of parts via a parts feeder, automatic measurement of workpieces after processing, and automatic discharge. - Capable of responding to demands not only for processing precision and efficiency but also for overall productivity improvement. *For more details, please refer to the related links or feel free to contact us.

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Grinding Machine Comprehensive Catalog

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High Frequency Spindle Series (Japanese Digest Version)

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