C18150(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

last updated Nov 05, 2025

C18200(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

last updated Nov 05, 2025

Aluminum Silicon (Al-Si) Target [Alloy Target]

In adjustment.

last updated Nov 05, 2025

Aluminum Titanium (Al-Ti) Target

Aluminum Titanium (Al-Ti) Target

last updated Nov 05, 2025

Aluminum Neodymium (Al-Nd) Target

Aluminum neodymium materials suitable for wiring of flat panel displays, magnetic recording media, and magnetic sensors.

last updated Nov 05, 2025

Tungsten Titanium (W-Ti) Target

Tungsten-titanium materials that can be used as diffusion barriers and adhesives for metal wiring in microchip gate circuits.

last updated Nov 05, 2025

Nickel-Vanadium (NiV) Target

Contributing to the manufacturing of integrated circuits (ICs) and the semiconductor and microelectronics industry! Nickel-vanadium materials capable of depositing high-quality thin films.

last updated Nov 05, 2025

Nickel-chromium (NiCr) target

Nickel-chromium that can be used for thin film formation, microelectronics manufacturing, Low-E films for architectural glass, liquid crystal panels, and recording media!

last updated Nov 05, 2025

Nickel-Copper (NiCu) Target

Alloy materials that can be used for semiconductor integrated circuits (VLSI), flat panel displays, optical discs, surface coatings, etc.

last updated Nov 05, 2025