合金ターゲット
合金ターゲット
合金ターゲット
1~9 item / All 9 items
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C18150(Cu) backing plate
Used as a backing plate, alloy material with hardness ≧ 1/2H!
last updated
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C18200(Cu) backing plate
Used as a backing plate, alloy material with hardness ≧ 1/2H!
last updated
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Aluminum Silicon (Al-Si) Target [Alloy Target]
In adjustment.
last updated
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Aluminum Titanium (Al-Ti) Target
Aluminum Titanium (Al-Ti) Target
last updated
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Aluminum Neodymium (Al-Nd) Target
Aluminum neodymium materials suitable for wiring of flat panel displays, magnetic recording media, and magnetic sensors.
last updated
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Tungsten Titanium (W-Ti) Target
Tungsten-titanium materials that can be used as diffusion barriers and adhesives for metal wiring in microchip gate circuits.
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Nickel-Vanadium (NiV) Target
Contributing to the manufacturing of integrated circuits (ICs) and the semiconductor and microelectronics industry! Nickel-vanadium materials capable of depositing high-quality thin films.
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Nickel-chromium (NiCr) target
Nickel-chromium that can be used for thin film formation, microelectronics manufacturing, Low-E films for architectural glass, liquid crystal panels, and recording media!
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Nickel-Copper (NiCu) Target
Alloy materials that can be used for semiconductor integrated circuits (VLSI), flat panel displays, optical discs, surface coatings, etc.
last updated