C18150(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

last updated Nov 05, 2025

C18200(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

last updated Nov 05, 2025

Aluminum Silicon (Al-Si) Target [Alloy Target]

In adjustment.

last updated Nov 05, 2025

Aluminum Titanium (Al-Ti) Target

Aluminum Titanium (Al-Ti) Target

last updated Nov 05, 2025

Aluminum Neodymium (Al-Nd) Target

Aluminum neodymium materials suitable for wiring of flat panel displays, magnetic recording media, and magnetic sensors.

last updated Nov 05, 2025

Tungsten Titanium (W-Ti) Target

Tungsten-titanium materials that can be used as diffusion barriers and adhesives for metal wiring in microchip gate circuits.

last updated Nov 05, 2025

Nickel-Vanadium (NiV) Target

Contributing to the manufacturing of integrated circuits (ICs) and the semiconductor and microelectronics industry! Nickel-vanadium materials capable of depositing high-quality thin films.

last updated Nov 05, 2025

Nickel-chromium (NiCr) target

Nickel-chromium that can be used for thin film formation, microelectronics manufacturing, Low-E films for architectural glass, liquid crystal panels, and recording media!

last updated Nov 05, 2025

Nickel-Copper (NiCu) Target

Alloy materials that can be used for semiconductor integrated circuits (VLSI), flat panel displays, optical discs, surface coatings, etc.

last updated Nov 05, 2025

Sputtering

We deliver target materials for PVD and materials for vacuum deposition in small quantities and with short lead times!

last updated Apr 02, 2026