May event! Electronic Materials Analysis Webinar

ティー・エイ・インスツルメント・ジャパン (TAInstruments)
Event Date and Time: May 16, 2024 (Thursday) For details and registration, please visit the link below! https://pages.waters.com/2024-05-31-WBN-TAJP-Electronicmaterialsseminar_LP-Registration1.html 13:00 - 14:30 [Title] Case Studies of Failures in Semiconductor Electronic Components Caused by Stress and Moisture Absorption, and Evaluation of the Properties of Packaging Materials [Speaker] Tetsuya Onishi, Managing Director, G.J.Tech (Grand Joint Technology Ltd.), a consulting company specializing in semiconductor-related packaging processes 14:30 - 14:45 [Title] Introduction to the Discovery SA Moisture Absorption and Desorption Weight Measurement Device [Speaker] Minako Maeda, Applications Department, TA Instruments 14:45 - 15:00 [Title] Measurement Devices and Case Studies of Expansion and Viscoelasticity Under Temperature and Humidity Changes [Speaker] Yasuki Otsuka, Applications Department, TA Instruments

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Date and time Thursday, May 16, 2024
01:00 PM ~ 03:00 PM
- Entry fee Free