TY-CHECKER Type E Tester for Semiconductors
Contributing to improved yield in semiconductor manufacturing with high-speed, high-precision inspection!
In the semiconductor industry, accurate inspection of substrates is essential to ensure product quality and reliability. Especially as miniaturization progresses, issues such as connectivity failures, insulation failures, and shorts can significantly reduce yield. The TY-CHECKER Type E tester contributes to yield improvement by quickly detecting these problems through high-speed and high-precision inspection. 【Usage Scenarios】 * Inspection in the semiconductor substrate manufacturing process * Inspection of FPC (Flexible Printed Circuit Boards) * Inspection of package and module substrates 【Benefits of Implementation】 * Prevents the outflow of defective products and improves yield * Increases productivity by reducing inspection time * Capable of addressing diverse inspection needs
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**Features** * Tester that forms the core of the electric inspection system "TY-CHECKER series" * Compact design * Abundant options * Excellent versatility **Our Strengths** Taiyo Technorex Co., Ltd. provides full support from FPC design, prototyping, and mass production to board electrical inspection, appearance inspection systems, and FA automation. With years of experience and technical expertise, we contribute to solving our customers' challenges.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*