~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.

**SPEXA - International Space Business Expo Overview** Date: May 27 (Wed) - 29 (Fri), 2026, 10:00 - 17:00 Location: Tokyo Big Sight, South Hall Booth: No. S10-40 (Wakayama Prefecture) **Exhibition Content** ■ Efforts in FPC Development for the Space Industry We are promoting the development of high-reliability FPCs that can withstand harsh environments. By collaborating with and participating in meetings with space-related companies and organizations, we identify needs and propose wiring and processes based on JAXA specifications. ■ FPC We will introduce PI-based compact and lightweight FPCs. We respond to small lot and short delivery time requirements, meeting the needs of satellite development. Our thin, lightweight, and highly flexible designs enhance design freedom, allowing for consistent support from design to processing to implementation and assembly.

[ Kansai ] Nepcon Japan Overview Date: May 13 (Wednesday) to 15 (Friday), 2026, 10:00 AM to 5:00 PM Location: Intex Osaka, Hall 6 Booth: Space number ▲▲▲ (very close to the keynote speech and open seminar venue)

Our company will exhibit at the "40th InterNepcon Japan" held at Tokyo Big Sight from January 21 (Wednesday) to January 23 (Friday), 2026, with the themes of "Experience," "High Density," and "Space." Here, you will not only be able to see a variety of FPCs (Flexible Printed Circuits) on display but also experience their features by directly touching them. Additionally, we will showcase high-density wiring FPCs with filled via structures, as announced in our October 27, 2025 publication on "Improving High-Density Wiring Formation Technology Using Pattern Via Fill Methods," and introduce the technical advantages and development status of FPCs for the space industry that are currently under development. In particular, for FPCs used in the space industry, which require extremely high reliability, we are advancing development with an eye on the standards set by organizations like JAXA, as they are expected to be used under the most severe environmental conditions, including extreme temperature changes, intense vibrations, gas release (outgassing) in a vacuum, and radiation. We will display prototypes that have undergone special material selection and structural design to achieve heat resistance and vibration resistance under harsh conditions. Please come to our booth to confirm the evolution of FPC technology and its potential that our company is pursuing.

We have newly launched an "Electronics Manufacturing Services (EMS)" that provides a comprehensive response from material procurement, circuit design, manufacturing, and assembly to functional testing and shipping in the traditional FPC (Flexible Printed Circuit Board) manufacturing process. In recent years, the use of FPCs has expanded across various fields such as medical devices and industrial equipment, leading to an increased demand not only for supply but also for a one-stop solution that encompasses circuit design, module manufacturing, and even final product assembly. To meet these market demands, we have strengthened our collaboration with electronics manufacturing companies and established a manufacturing system that covers everything from material procurement to assembly. With this service, customers can reduce interactions with multiple vendors, achieve shorter lead times, and improve manufacturing efficiency. Our stringent quality control system ensures the delivery of highly reliable products. The product areas we can support include automotive devices, medical devices, industrial equipment, robotics, communication devices, lighting equipment, and home appliances, allowing us to meet a wide range of manufacturing needs.

Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.

Our company has decided to participate in the "Space Town Development Promotion Project (Kii Space HUB)," which aims to create new industries and revitalize the region with a space theme, promoted by Wakayama Prefecture, in our core business of electronic substrate. Taking this opportunity, we will actively advance our technological development and business enhancement in the space field. The Space Town Development Promotion Project is a project aimed at the accumulation of the space industry, human resource development, and regional revitalization in Wakayama Prefecture, where the private rocket launch site "Spaceport Kii" is located, and it has garnered national attention. We aim to contribute to the lightweight and high functionality of space equipment by leveraging the manufacturing technologies of flexible printed circuit boards and electroforming that we have cultivated so far. In the future, we will actively engage in human resource development for those involved in the space business, starting with the provision of technology for satellite-mounted equipment and communication modules. We will also consider collaboration with private space companies, promoting value creation and business development in this new field of the space industry, while striving to balance technological innovation and social contribution, and continuing our challenges toward realizing a sustainable future.

Notice regarding the transfer of the representative director (additional selection) and the transfer of officers We would like to inform you that at the board of directors meeting held on November 8, 2024, a resolution was made regarding the transfer of the representative director (additional selection) and the transfer of officers.

◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of lightweight, flexible, fine, and special FPCs in four different zones. 1. Comparison of weight between rigid boards and FPCs 2. FPCs that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPCs with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. Not only FPCs! We also have a live demonstration of the latest appearance inspection system using AI technology in the fields of FA and automation! ◎FA Automation: By achieving teaching-less operation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed automation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, the AI system "TY-VISION XAIS," is now in Chapter 2! In addition to improving efficiency by reducing false reports in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect with inspection equipment, even though they can be identified visually.

An article about our company was published in the newsletter issued by Teikoku Databank, Ltd. "Ariadne's Thread 'Teikoku News Kansai Edition' (November 14, 2024 issue)"

Microfabrication technology (photofabrication) plays an important role as a production technology, producing precision machined components such as lead frames, HDD suspensions, encoders, TAB tapes, various filters, and decorative items. Additionally, based on photofabrication technology, current advanced technologies such as printed circuit boards, photomasks for LSI, color filters for color liquid crystal display devices, and semiconductors are also being developed. [Source: Photofabrication Association - Technical Explanation]

With Taiyo Techno Rex's FPC short delivery service, you can smoothly transition to high-quality mass production. From prototyping to mass production, everything is managed in one place! ■ Reliable track record ■ One-stop service ■ Flexible response capability ■ Short delivery times, high quality, and the latest technology

Improvement of High-Density Wiring Molding Technology Our company has been able to enhance the molding technology for high-density wiring in our core business, the electronic substrate business. As we announced in our notice dated March 6, 2023, regarding capital investment in the electronic substrate business, we have introduced production equipment to respond to the improvement of technology and the increasing demand for product commercialization.

Do you have any concerns regarding circuit design? Taiyo Technorex is strengthening its support for issues related to circuit boards. "Over 1,000 development achievements!" We have numerous accomplishments in promoting electrification, power circuits, and motor control. We invite you to take a look at our catalog, and we look forward to your inquiries.

Are you having trouble detecting those fine defects? Why not try inspecting them with TY-VISION? The M111SC detects defects of about 10μm with an optical resolution of 2.5μm! Are you currently detecting them with your final appearance inspection machine? [YES・NO] If so, are there few false positives? [YES・NO] If you answered NO to any of these questions, please give TY-VISION a try. It boasts top-class detection performance for package substrates, ceramic substrates, FPCs, and more. It is also widely adopted in mass production processes, and by adding the AI system XAIS, it dramatically reduces the number of false positives. We are available for demo inspections at any time, so please feel free to consult with us. *If you wish to conduct an inspection, please provide the substrate information first, and we will hold the data and the subject.

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! Fine patterns make the wiring less noticeable. 〇 Made with polyimide that excels in heat resistance and flame retardancy. ⇒ Compatible with reflow mounting. ★ Suitable for display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes.

Thank you for taking a look. *We have compiled commonly used terms in FPC manufacturing. Please make use of it. *The glossary has been extracted from the book "【All You Need to Know About FPC in One Volume! *With Glossary】." With over 40 years of experience in flexible printed circuit board manufacturing, we offer one-stop services from prototyping to mass production. There are things that only TAIYO can do. *The following content is from the complete version of "【All You Need to Know About FPC in One Volume! *With Glossary】." Highly recommended! [Document Contents] 1. Solve all your FPC problems at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Introduction to various types of FPC (ultra-fine wires, multilayer, high frequency, etc.) 7. FPC glossary 8. Greetings and company overview (Total of 36 pages) We hope this will be helpful for your consideration of flexible printed wiring boards. Taiyo Industry will sincerely respond to inquiries regarding FPC.

If you're interested in flexible substrates, this is a must-see! This is a highly acclaimed document, so please download it! * A PowerPoint version is now available for download separately. Please visit the product page and download it from "Sample Software"! FPC: We are waiting for your inquiries and any issues regarding flexible printed circuit boards. #CircuitBoard #FlexiblePrintedWiringBoard #BoardManufacturing

TAIYO Web Shop is currently selling the "Super Water-Repellent Film" with great acclaim! We provide a clear view with astonishing water-repellent power. Please scan the QR code on the right side of the page or visit the following URL to access our e-commerce site: https://taiyo-xelcom.easy-myshop.jp/ We offer a lineup of rolled, pre-cut, and rotating window options! *Please note that the intended use is limited to "marine applications," but feel free to contact us if you are interested. By applying a special processing to the film's surface inspired by lotus leaves, we have recreated the lotus effect. We have received feedback from ship operators and those in the fishing industry, such as: - The film repels splashes of water, improving visibility. - Sea salt would dry and stick, making cleaning a hassle, but the workload has significantly decreased. - The anti-reflective feature makes it easier to see handheld measuring devices. - When applied to both the front and back of windows (glass), visibility remains clear even at night. Water-Repellent Film (for marine use)

Aiming for new value creation in FPC! The company name has been renewed from "Taiyo Kogyo" to "Taiyo Technorex"! This change embodies a strong desire to carve out the future with flexible technology. The demands for FPC are increasing daily, shifting from mere wiring components to high-function components with various added values. Taiyo Technorex will sensitively capture the needs of the next generation and lead FPC with flexible technological capabilities.

<Kit Contents> - A pressure-sensitive surface sensor with 128 arranged cells - A control board that processes the sensor signals - A PC application that displays the data signals *You can check the 256 levels of relative output on the PC screen and export it as CSV. <Sensor Specifications> - Sensor Size: 50*35mm (sensor part only) - Method: Pressure-sensitive resistive film method - Cell Size: 2*3mm - Number of Cells: 128 cells (16*8) The above sensor can also be customized. Each customized sensor is applied in various fields such as robotics, medical care, sports training equipment, toys, games, and ergonomic research.

Achieving both efficiency and error-proofing through automatic identification! It is possible to build a flexible system with a conveyor system and dual-arm robots. (FA Automation Implementation Case) ● Manufactured as an automatic loading and unloading system for printed circuit board manufacturing equipment and auto-cut laminators (manufactured by Hakuto). 【Features】 　〇 Automatically extracts laminated materials through automatic identification and performs stable suction transport by automatically identifying the size of the equipment. 　〇 Automatically identifies the size of the equipment after passing through the auto-cut laminator and unloads it using dual-arm robots. 【Effects】 　〇 It has become possible to load equipment of various lengths at once, significantly improving work efficiency.

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling technology! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, leading to a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating enables high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates and IC mounting The fusion of these two processing technologies has realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard

Involved in the manufacturing of flexible printed circuit boards for over 40 years. We offer a one-stop service from prototyping to mass production. There are things that only TAIYO can do. 【Contents】 1. Solve all your FPC problems at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Information on various types of FPC (ultra-fine wires, multi-layer, high frequency, etc.) 7. FPC glossary 8. Greetings and company overview (Total of 36 pages) We hope this will be helpful for your consideration of flexible printed circuit boards. Taiyo Industry sincerely responds to inquiries regarding FPC.

The "TY-CHECKER DS401" is a powered inspection system that adds X-direction movement (horizontal movement) to the conventional Y-direction step-and-repeat transport. Since the device is semi-automatic, the entire front of the machine is almost open, making it easy to handle the workpieces. It is designed to be useful in product development and manufacturing environments. Transitioning to mass production can also be done smoothly by adopting the AT type. *We also assist with the supply of jigs! It supports both a unique dedicated plate holding method that does not apply tension and a tension holding method, allowing selection according to the product. By swapping the measurement unit, high-frequency characteristic testing can be performed either on sheets or individual pieces, leveraging the advantages of jig fixation to achieve stable automatic/semi-automatic high-frequency testing. 【Features】 ■ Maximum substrate size: 305mm x 510mm ■ Step-and-repeat transport in the XY direction ■ Contributes to downsizing of jig head (reducing jig costs) ■ Continuity, insulation, 4-terminal testing, micro-short detection ■ High-frequency characteristic testing compatible with 'VNA, LCR, TDR' *For more details, please refer to the PDF document or feel free to contact us.

This is a very popular document. It provides a clear explanation of the general manufacturing process of FPC at our company, incorporating animation. Please take a look. 【Business Overview】 ■ Electronic Circuit Board Business - Design and production of flexible printed circuit boards - Assembly of printed circuit boards, etc. ■ Test System Business - Development and manufacturing of circuit board power-on inspection systems - Development and manufacturing of final appearance inspection systems for circuit boards, etc. ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems, etc. ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines, etc.

Involved in the manufacturing of flexible printed circuit boards for over 40 years. We offer a one-stop service from prototyping to mass production. There are things that only TAIYO can do. 【Contents】 1. Solve all your FPC problems at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Information on various types of FPC (ultra-fine wires, multilayer, high frequency, and others) 7. FPC glossary 8. Greetings and company overview (Total of 36 pages) We hope this information will be helpful in your consideration of flexible printed circuit boards. Taiyo Industry will sincerely respond to your inquiries regarding FPC.

Surface treatment with plating to prevent light reflection, enabling micron-level ultra-fine processing! It is widely applied in fields such as electronic components and semiconductors.