太洋テクノレックス 本社　和歌山 Official site

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

MSAP (Modified Semi Additive Process) method Via filling: Filling through-hole holes with copper plating

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

We are engaged in product development using various materials, including fluorine composite materials, MPI, and LCP. Collaboration for joint launches is also possible. We hope you will consider this.

We have compiled terms used in meetings related to FPC manufacturing. Please use it as an introductory mini-dictionary and an offline search tool.

All about FPC! A glossary of terms related to flexible printed circuits.

From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

- CCL conversion of the substrate (high-temperature press capability) - Simulation design to production (MSAP possible) - Evaluation measurement of test samples and report submission

Consistent support from development design to parts procurement, manufacturing, implementation, and assembly with short delivery times. Capable of small lot and diverse prototype and mass production.

【Our Provided Services】 ◎ FPC design and manufacturing ◎ Printed circuit board assembly ◎ Electronic circuit CAD design ◎ Mass production support for single or limited production (such as repair parts) ◎ Design and manufacturing of high-difficulty wiring FPCs (such as ultra-fine pitch) 【Content of the Materials (Excerpt)】 ◎ Standard FPC ◎ Bump FPC and crimp processing ◎ High-functionality FPC ◎ FPC glossary *For more details, please contact us.

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.

For more details, please refer to the PDF document or feel free to contact us.

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

【Other Listings】 ■Development ■Etching ■Peeling ■Intermediate Inspection (AOI) ■Coverlay Processing ■Coverlay Temporary Bonding ■Coverlay Heat Press ■Printing (Silk) ■Surface Treatment (NiAu Plating) ■Sheet Bonding Processing (Reinforcement Plate) ■Reinforcement Plate Heat Press / Heat Roller ■Outline Processing (Mold) ■Outline Processing (Thomson Die) ■Final Inspection ■FPC Completion ■Component Mounting *For more details, please refer to the PDF document or feel free to contact us.

We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aerospace field!

【Processing Standards (Excerpt)】 <Pattern (Min Value)> ■Single-sided L/S: 15μm/15μm (Line width ±5μm) ■Double-sided L/S: 35μm/35μm (Line width ±10μm) ■Total pitch: ±0.05% or more *For more details, please refer to the PDF document or feel free to contact us.

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

■─────────　 EMS Support Scope and Technical Information　─────────■ ＜Design Support＞ 　• Circuit design / FPC・PCB layout / Component selection (RoHS・REACH compliant) ＜Manufacturing Process＞ 　• Supports 0402 size / BGA mounting / Mixed reflow and hand soldering ＜Assembly Process＞ 　• Enclosure processing and assembly / Cable procurement and wiring / Integration with mechanical components ＜Inspection Process＞ 　• ICT / FCT / Visual inspection / Barcode and QR management / Traceability support ＜Prototype to Mass Production＞ 　• Flexible support from small-scale prototypes to mass production (no MOQ) ■───────────　Quality and Management System　────────────■ 　• ISO9001 certified 　• Complete ESD management area 　• Clean room support (as needed) 　• Cost optimization through collaboration with overseas bases ■────────────────────────────────■

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

For detailed information, please contact us at the address below. Taiyo Technorex responds to various inquiries from our customers. Contact information: Headquarters Wakayama: 073-431-6312 Tokyo Office: 03-6275-0690