Taiyo TechnoRex has established manufacturing technology for 4-layer FPC (Flexible Printed Circuit Board) using the MSAP (Modified Semi Additive Process) method, which was developed to improve high-density wiring technology. Compared to conventional methods, it enables high-precision line width management, achieving fine wiring formation of 10μm/20μm (line/space) in 4-layer FPCs. This technology ensures high wiring accuracy and reliability of interlayer connections, making it possible to accommodate high-density and high-function circuit designs. The technology is expected to be applied not only in wearable devices and medical equipment but also in next-generation communication devices requiring high-frequency and high-speed transmission technology, AI server-related equipment, and ADAS and autonomous driving-related devices.

~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.

**SPEXA - International Space Business Expo Overview** Date: May 27 (Wed) - 29 (Fri), 2026, 10:00 - 17:00 Location: Tokyo Big Sight, South Hall Booth: No. S10-40 (Wakayama Prefecture) **Exhibition Content** ■ Efforts in FPC Development for the Space Industry We are promoting the development of high-reliability FPCs that can withstand harsh environments. By collaborating with and participating in meetings with space-related companies and organizations, we identify needs and propose wiring and processes based on JAXA specifications. ■ FPC We will introduce PI-based compact and lightweight FPCs. We respond to small lot and short delivery time requirements, meeting the needs of satellite development. Our thin, lightweight, and highly flexible designs enhance design freedom, allowing for consistent support from design to processing to implementation and assembly.

[ Kansai ] Nepcon Japan Overview Date: May 13 (Wednesday) to 15 (Friday), 2026, 10:00 AM to 5:00 PM Location: Intex Osaka, Hall 6 Booth: Space number ▲▲▲ (very close to the keynote speech and open seminar venue)

Our company will exhibit at the "40th InterNepcon Japan" held at Tokyo Big Sight from January 21 (Wednesday) to January 23 (Friday), 2026, with the themes of "Experience," "High Density," and "Space." Here, you will not only be able to see a variety of FPCs (Flexible Printed Circuits) on display but also experience their features by directly touching them. Additionally, we will showcase high-density wiring FPCs with filled via structures, as announced in our October 27, 2025 publication on "Improving High-Density Wiring Formation Technology Using Pattern Via Fill Methods," and introduce the technical advantages and development status of FPCs for the space industry that are currently under development. In particular, for FPCs used in the space industry, which require extremely high reliability, we are advancing development with an eye on the standards set by organizations like JAXA, as they are expected to be used under the most severe environmental conditions, including extreme temperature changes, intense vibrations, gas release (outgassing) in a vacuum, and radiation. We will display prototypes that have undergone special material selection and structural design to achieve heat resistance and vibration resistance under harsh conditions. Please come to our booth to confirm the evolution of FPC technology and its potential that our company is pursuing.

We have newly launched an "Electronics Manufacturing Services (EMS)" that provides a comprehensive response from material procurement, circuit design, manufacturing, and assembly to functional testing and shipping in the traditional FPC (Flexible Printed Circuit Board) manufacturing process. In recent years, the use of FPCs has expanded across various fields such as medical devices and industrial equipment, leading to an increased demand not only for supply but also for a one-stop solution that encompasses circuit design, module manufacturing, and even final product assembly. To meet these market demands, we have strengthened our collaboration with electronics manufacturing companies and established a manufacturing system that covers everything from material procurement to assembly. With this service, customers can reduce interactions with multiple vendors, achieve shorter lead times, and improve manufacturing efficiency. Our stringent quality control system ensures the delivery of highly reliable products. The product areas we can support include automotive devices, medical devices, industrial equipment, robotics, communication devices, lighting equipment, and home appliances, allowing us to meet a wide range of manufacturing needs.

Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.

Our company has decided to participate in the "Space Town Development Promotion Project (Kii Space HUB)," which aims to create new industries and revitalize the region with a space theme, promoted by Wakayama Prefecture, in our core business of electronic substrate. Taking this opportunity, we will actively advance our technological development and business enhancement in the space field. The Space Town Development Promotion Project is a project aimed at the accumulation of the space industry, human resource development, and regional revitalization in Wakayama Prefecture, where the private rocket launch site "Spaceport Kii" is located, and it has garnered national attention. We aim to contribute to the lightweight and high functionality of space equipment by leveraging the manufacturing technologies of flexible printed circuit boards and electroforming that we have cultivated so far. In the future, we will actively engage in human resource development for those involved in the space business, starting with the provision of technology for satellite-mounted equipment and communication modules. We will also consider collaboration with private space companies, promoting value creation and business development in this new field of the space industry, while striving to balance technological innovation and social contribution, and continuing our challenges toward realizing a sustainable future.

Notice regarding the transfer of the representative director (additional selection) and the transfer of officers We would like to inform you that at the board of directors meeting held on November 8, 2024, a resolution was made regarding the transfer of the representative director (additional selection) and the transfer of officers.

An article about our company was published in the newsletter issued by Teikoku Databank, Ltd. "Ariadne's Thread 'Teikoku News Kansai Edition' (November 14, 2024 issue)"

Notice of Company Name Change In order to strengthen our brand power and aim for further business expansion and enhancement of corporate value in the future, we have changed our company name from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd." Additionally, we have refreshed our corporate logo to align with the name change. [Thoughts Behind the New Company Name] The coined term "TECHNOLEX," derived from "Technology" and "Flexible," symbolizes the flexibility of our main product, FPC (Flexible Printed Circuit Board), as well as our commitment to adapt flexibly to new technologies and areas such as technology trading, beyond conventional techniques. We are evolving to break out of the confines of "industry" and to transition towards a more global market. For more details, please check here.

We will explain the development concept and features of the latest automatic machine 'TY-VISION A308DC', which was exhibited at Nepcon Japan 2023, as well as future plans. We have released a final appearance inspection device for high-precision substrates, suitable for package and module substrates. An online exhibition hosted by evort: 'Semiconductor and Electronic Components Comprehensive Exhibition' [Semiconductor Inspection, Measurement, and Analysis Exhibition] has added a new webinar. You can view explanations of the latest image inspection technology and future prospects.

【TAIYO Web Shop News】 The TAIYO Web Shop is currently selling the 'Super Water-Repellent Film' with great acclaim! We provide a clear view with its amazing 'water-repelling power.' To access our e-commerce site, please scan the QR code on the right side of the page or visit the following URL: https://taiyo-xelcom.easy-myshop.jp/ We offer a lineup of roll, pre-cut, and rotating window options! *Please note that the application is limited to 'marine use,' but feel free to contact us if you are interested. By applying a special processing to the film's surface inspired by lotus leaves, we have recreated the lotus effect. We have received feedback from marine operators and those in the fishing industry, such as: - The film repels splashes of water, improving visibility. - Sea salt would dry and stick, making cleaning a hassle, but the workload has significantly decreased. - The anti-reflective feature has made it easier to see handheld measuring devices. - Applying it to both the front and back of windows (glass) has resulted in clear visibility even at night. Water-Repellent Film (for marine use)

Thank you very much for your many visits during the event. You can find information about the exhibited machines on the product pages. ■ Final Appearance Inspection Device [NEW] TY-VISION M111SC ■ Electrical Inspection System TY-CHECKER DS401 "Flexible inspection solutions for various applications!" Booth Number: 2B-12 Exhibition: JPCA Show 2023 Exhibition Zone: Printed Circuit Board Technology Exhibition We are showcasing two types of inspection devices: an appearance inspection machine and an electrical inspection machine. Both inspection machines are designed utilizing the know-how accumulated as an FPC manufacturer, allowing us to propose the optimal inspection methods for electronic circuit boards. The appearance inspection machine is the latest model M111SC, equipped with our smallest resolution camera at 2.5µm. The electrical inspection machine is the latest model DS401, featuring even higher performance functions from the DS series, which is specialized for FPC. Please stop by and take a look at each inspection machine at the venue.

【Aggregation Period】April 5, 2023 - April 11, 2023 ★Company Ranking (Out of a total of 44,072 points) ￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣ 4th Place: Taiyo Kogyo Co., Ltd. Wakayama 【Thank You】 Thank you very much for the many accesses. 【Company Overview】 Taiyo Kogyo Co., Ltd. operates in the fields of prototype development of flexible printed circuit boards (FPC) and the manufacturing of circuit board inspection equipment. FPCs are fundamentally related to the structure of hardware, requiring both high precision quality and shortened development periods. On the other hand, the circuit board inspection systems mainly include electrical inspection systems and final appearance inspection systems, which are also adopted in the mass production sites of FPCs and package/module type circuit boards. 【Business Activities】 ■ Electronic Circuit Board Business - Design and manufacturing of flexible printed circuit boards - Printed circuit board assembly and other services ■ Test System Business - Development and manufacturing of circuit board electrical inspection systems - Development and manufacturing of final appearance inspection systems and other services ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems and other services ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines and other services

We are pleased to announce that our company has been certified as a "Health Management Excellent Corporation 2023 (Small and Medium-sized Enterprises Division)" by the Japan Health Conference, continuing from last year. Announcement regarding the certification of "Health Management Office (Oita Prefecture) 2023" We are pleased to announce that our Kyushu office has received the certification of "Health Management Office" from Oita Prefecture. Oita Prefecture supports the philosophy of "health management," which aims to link the health promotion of workers to the growth of companies, and is working to promote offices that engage in employee health management. In collaboration with the National Health Insurance Association Oita Branch (Kyokai Kenpo), they are implementing a certification system for "Health Management Offices" targeting all offices in Oita Prefecture.

Notice Regarding the Renewal of Our Company Website On March 13, 2023, we renewed our company website with the following details. 1. Change of New Website URL (Domain) https://www.taiyo-tx.com *There is no change to the product site URL. 2. Renewal of Corporate Site and IR Site

[TAIYO Archives] We are introducing past topics and more. This was aired on June 5, 2015, and it feels a bit nostalgic as it was about 8 years ago, but it is quite a well-made introduction video. Please take a look at it!

We have been featured in the "Case Studies on VOC Measures Leading to a Sustainable Future for Companies and Society," compiled by the Kansai Bureau of Economy, Trade and Industry. Please take a look. You can find the link to the special page of the Kansai Bureau of Economy, Trade and Industry at the following URL: https://www.kansai.meti.go.jp/3-6kankyo/R4fy/jirei_VOC20230125.html You can also view our initiatives in the related materials.

Due to our December financial closing, we have updated "Company Overview 2021" to "Company Overview 2022." Please take a look if you are interested. You can find more detailed corporate information on our company website. We hope you find it useful. "Company Overview 2021" continues to be publicly available within our special page on iPROS. You can access it via the following URL: https://premium.ipros.jp/taiyo-kougyo/catalog/category/55976/

We are pleased to announce that we have developed sales channels for flexible printed circuit boards (FPC) in the U.S. medical device market within our core business of electronic substrates. Traditionally, FPC has been primarily used in smartphones, digital cameras, and automotive equipment; however, in recent years, we have focused on product development for medical devices, which is one of the growing markets due to changes in the market environment. As a result, the proportion of FPC sales to medical device manufacturers within our group reached 12.9% in fiscal year 2021 and 15.7% as of the third quarter of fiscal year 2022, with a trend of increasing orders. Further details will follow (please see the attached file). This is our press release, and we would like to inform you that it has been featured in the "Printed Circuit Journal," the only specialized magazine in the printed circuit board industry. (We have received approval for the publication in the magazine.)

Our company sells mirror polishing machines manufactured by our consolidated subsidiary, Mirac Co., Ltd. These machines have primarily been used for the final mirror polishing of gravure printing rolls and for surface polishing of hydraulic cylinders in industrial equipment. As a result of our marketing activities in this business, we are pleased to announce that we have achieved results in polishing the surfaces of plating rolls used in the production of lithium-ion batteries, which are experiencing growing demand. In recent years, lithium-ion batteries have rapidly expanded not only in mobile devices but also as a power source for passenger cars and other applications. We recognize this as a business opportunity and will further advance the market development of mirror polishing machines.

Notice of Additional Payment Method for the EC Site "TAIYO Web Shop" The web shop, which started on May 10, 2021, has added convenience by introducing convenience store payments in addition to the traditional credit card payment method. We look forward to welcoming you to the "TAIYO Web Shop." URL: https://taiyo-xelcom.easy-myshop.jp 【Products Offered】 * Custom flex * Cable flex * Special flex * Electroforming processed products * Industrial parts and materials (water-repellent films, etc.) * Industrial equipment and devices (microscopes, electrostatic visualization monitors) * Information on board inspection equipment, etc.

We are pleased to announce that our company was certified as a "Health Management Excellent Corporation 2022 (Small and Medium-sized Enterprises Division)" by the Japan Health Conference on March 9, 2022.

We would like to inform you that at the board of directors meeting on July 30, our company has resolved to relocate the Tokyo office of the Sales Department (located in Kudankita, Chiyoda-ku, Tokyo) as follows. Please note that the phone number and other contact details have also changed. (New Address) 6th Floor, Kiyo Tokyo Building, 2-5 Kanda Ogawamachi, Chiyoda-ku, Tokyo Phone: 03-6275-0690 Fax: 03-6275-0699 Business Start Date: August 10, 2021

【TAIYO Web Shop News】 Sales of the "Super Water-Repellent Film" have begun! The application is limited to "marine use," but please contact us separately if you are interested. By applying a special processing to the film's surface inspired by lotus leaves, we have recreated the lotus effect. We have received feedback from ship operators and those in the fishing industry, including: - It repels splashes of water, improving visibility. - Sea salt that dried and stuck white was a hassle to clean, but the workload has been significantly reduced. - The anti-reflective feature has made it easier to see handheld measuring devices. - When applied to both the front and back of windows (glass), visibility remains clear even at night. Water-Repellent Film (for marine use)

Our company is working on the development of build-up substrates using polyimide for the insulating layer, aimed at miniaturizing, thinning, and lightening multilayer substrates in our core electronic substrate business. We are pleased to announce that we have established the core filled via technology. In electronic devices that are becoming lighter, more compact, and high-functioning, substrates (build-up substrates) capable of high-density wiring and high-density mounting are in demand. However, typically, the core layer of build-up substrates uses rigid boards, which increases the thickness of the substrate and hinders the lightweight and compact design of electronic devices. The filled via technology we have established involves filling holes (vias) made by laser in flexible printed circuit boards (FPC) with an insulating layer of polyimide with copper, and flattening the surface of the filled areas. By using this FPC as the core layer or outer layer of build-up substrates, it becomes possible to achieve both high-density wiring and high-density mounting along with thinning. We plan to start providing build-up substrates using this technology within the fiscal year 2022, and furthermore, by applying this technology to our strength in high-frequency compatible FPCs, we will respond to the demand for miniaturization of communication devices.

Announcement of the Opening of the EC Site "TAIYO Web Shop" Our company has been providing reliable products from prototype to mass production through transactions with corporate clients for many years. In response to customer needs such as "I want customized products in small lots" and "I want general-purpose FPCs," we have made it possible to conduct the entire process from ordering to payment non-face-to-face via computers and smartphones, allowing orders from individual customers as well. We will further expand our product lineup to meet the demands for small-lot production of various types from not only corporate clients but also individuals, universities, and research institutes. Orders have been accepted since May 10, 2021. We look forward to your visit to the "TAIYO Web Shop." URL: https://taiyo-xelcom.easy-myshop.jp 【Products Offered】 * Custom Flex * Cable Flex * Special Flex * Electroforming Processed Products * Industrial Parts and Materials (e.g., water-repellent films) * Industrial Equipment and Devices (e.g., microscopes, electrostatic visualization monitors) * Information on board inspection equipment, etc.