Plating that provides bonding properties
To enhance adhesion! Use neutral bath pure gold plating for gold plating.
We would like to introduce the "plating with bonding properties" that we handle. In plating with bonding properties, gold and silver plating are used. In particular, neutral bath pure gold plating is used for gold plating. Plating is applied to the parts where bonding occurs, specifically on the electrode parts of semiconductor devices and package leads, to enhance joint compatibility. Please feel free to contact us if you have any requests. 【Typical composition of neutral bath (partial)】 ■ Gold compound (metal salt): Potassium cyanide ■ Gold concentration: 8–10 ■ Conductive salt/acid: Citrate/phosphate ■ pH: 6–7 ■ Added metals: As or Ta *For more details, please download the PDF or feel free to contact us.
basic information
【Other representative neutral bath liquid compositions】 ■Temperature (°C): 60-70 ■Purity (%): 99.9-99.99 ■Hardness (Hv): 80-100 *For more details, please download the PDF or feel free to contact us.
Price range
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Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
