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  About plating(3)

  We would like to introduce the plating that we handle.

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  About metals(1)

  We would like to introduce the metals that we handle.

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  ICP emission spectrometer(1)

  We would like to introduce the "ICP Emission Spectroscopy Analyzer" that we handle.

• Barrel plating(7)

  About barrel plating

• Hoop plating(7)

  About hoop plating

• Rack plating(7)

  About rack plating and rackless plating.

• Chip resistor(1)

  We are conducting plating processes aimed at providing functionality for solder mounting on electrode parts ranging from size 1005 (L×W=1.0mm×0.5mm) to size 6330 (L×W=6.3mm×3.2mm). Our fully automated barrel plating equipment is controlled based on plating conditions (master data) determined by size and resistance values, allowing us to meet customer requirements. The sorting after plating is constructed using our in-house developed process that utilizes shape differences.

• Mobile phone, smartphone connector(1)

  We have established Ni barrier technology using our own specially manufactured drums and an inline laser stripping process, which accommodates low-profile, narrow-pitch products. Additionally, we have introduced image dimension measuring devices and video microscopes in both the production site and the quality control department to ensure a system that meets our customers' requirements.

• LED ceramic substrate(1)

  We developed our own rack-type automatic transfer plating equipment to uniformly apply gold plating to the contact areas of substrates for LED backlights in LCD TVs and ceramic substrates for LEDs. Despite being rack-type, there is almost no quality variation within and between substrates, leading to reduced material costs and enabling cost reduction in the plating process. Additionally, we have achieved labor savings by fully automating the loading and unloading processes.

Product/Service List (26)