All products and services
1～26 item / All 26 items
-
Unable to meet the specifications for plating thickness, the connector is not functioning as intended.
A case where we were able to achieve the process capability that the customer requires!
last updated
-
Countermeasures for solder wetting during connector substrate mounting! Review of spot Au plating fixtures.
We will introduce a case where a review of the spot Au plating jig successfully reduced the amount of Au plating deposition by 30%. This also contributed to reducing variation in plating between terminals.
last updated
-
Plating of connector terminals with hoop plating and hoop Au plating.
A non-gold-plated section (nickel-plated exposed section) is provided, and the thickness of the gold-plated section can be adjusted vertically! Additionally, technical documentation regarding surface treatment is also available!
last updated
-
Plating of fine products *Barrel size can be selected according to product shape and quantity.
Depending on the shape and quantity of the barrel plating products, we will adjust the hardness of the lead wires and the shape of the contact parts accordingly.
last updated
-
A must-see for those who want to eliminate variations in plating thickness between substrates! Rack plating.
Our unique belt conveyor system for fully automated plating results in very minimal variation in plating thickness between substrates.
last updated
-
We are currently offering two documents addressing the challenges of Au・Sn hoop plating!
Introducing examples related to the reduction of Au usage in Au-plated parts, improvement of Ni barrier function, and reduction of variation in Sn plating.
last updated
-
[Case Study] Reduction of Variation in Sn Plating
A case where we were able to achieve the process capability that the customer requires!
last updated
-
[Case Study] Reduction of Au in Au-plated parts and improvement of Ni barrier function.
We will introduce a case where it became possible to prevent Au plating deposition and suppress variation in plating between terminals.
last updated
-
About non-electrolytic plating
There are no restrictions on the shape of the plating target, and the uniformity is good! The main components are metal salts and reducing agents.
last updated
-
[Information] About Metals
A comprehensive explanation of the characteristics of representative metals! An introduction to light metals, heavy metals, precious metals, and base metals as well.
last updated
-
Testing methods for plating films
Check and evaluate whether the required functions have been implemented! Here are the main inspection items.
last updated
-
ICP emission spectrometer
Measure the wavelength and amount of the emitted light! Perform qualitative and quantitative analysis of the elements in the sample.
last updated
-
About Cu plating
Soft, highly stretchable, and excellent in processability! Used for decorative items and printed circuit boards, among others.
last updated
-
Plating to provide electromagnetic wave shielding properties.
Since it can transmit electromagnetic waves, shielding is necessary! A method of covering with a plating film has been adopted.
last updated
-
Electroconductive plating
Impart or enhance the property of conducting or transmitting electricity! Gold plating has good conductivity.
last updated
-
Plating that provides bonding properties
To enhance adhesion! Use neutral bath pure gold plating for gold plating.
last updated
-
Plating that provides solderability.
Essential technology for manufacturing electronic devices! Maintaining position through bonding.
last updated
-
[Plating Processing] Tateyama Denka Kogyo Co., Ltd. Business Introduction
A plating company for PGA pin chip resistors and connectors. Our customers' desire to "try it out" is the beginning of trust. Quality that does not betray is our history.
last updated
-
Plating on flat-type chip resistors (electrode part)
Plating process aimed at providing functionality for solder mounting on electrode parts sized 1005 to 6330!
last updated
-
Gold plating on LED ceramic substrates.
Due to the almost nonexistent quality variation within and between substrates, it leads to a reduction in material costs, making the plating process capable of cost reduction.
last updated
-
Partial gold plating of the connector terminals for mobile phones and smartphones.
We have established Ni barrier technology using in-house produced special drums and an inline laser stripping process, which allows us to accommodate low-profile, narrow-pitch products.
last updated
-
Gold plating for CPU (PGA) lead pins for computers and servers.
Developed a barrel structure suitable for ultra-fine products for PC plating, achieving a process that meets high customer demands! Reduced variation in plating thickness.
last updated
-
Inspection equipment owned by Tateyama Denka Kogyo Co., Ltd., a plating processing company.
Introducing the inspection equipment owned by Tateyama Denka Kogyo Co., Ltd., a company specializing in PGA pin and chip resistors and connector plating processing!
last updated
-
Metal surface treatment: hoop plating (hoop Au plating, hoop Sn plating)
A section without gold plating (exposed nickel plating) is provided, and the thickness of the gold-plated section can be adjusted vertically! Additionally, technical materials related to surface treatment are also available!
last updated
-
Barrel plating [Compatible with plating processing for fine parts!]
Depending on the shape and quantity of the product, we adjust the hardness of the lead wire and the shape of the contact part!
last updated
-
Rack plating and rackless plating
We are detecting abnormalities in the plating state through inline image processing!
last updated