We are currently offering two documents addressing the challenges of Au・Sn hoop plating!
Introducing examples related to the reduction of Au usage in Au-plated parts, improvement of Ni barrier function, and reduction of variation in Sn plating.
【Challenges faced by the customer in the case study】 ■Au Plating The existing customer was troubled by the rising procurement costs of Au-plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with solder wetting on unnecessary parts during the mounting of connectors on the circuit board, and sought our consultation. ■Sn Plating For a vehicle-mounted connector that the customer was developing, they required Sn plating on a certain component. However, they were unable to meet the specified thickness range for the plating that the customer desired, making it difficult to satisfy the functionality of the connector. *For details on the solutions and effects, please refer to the PDF document or feel free to contact us.
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