[Case Study] Reduction of Au in Au-plated parts and improvement of Ni barrier function.
We will introduce a case where it became possible to prevent Au plating deposition and suppress variation in plating between terminals.
We are introducing a case study where we reviewed the spot Au plating jig for our customer company, resulting in a reduction of Au usage in Au-plated components and an improvement in the Ni barrier function, thereby solving their issues. 【Challenges faced by the customer】 The existing customer was troubled by the rising procurement costs of Au-plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with unnecessary solder wetting on certain areas during the PCB assembly of the connectors, which led them to consult with us. For details on the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.
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