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Hollow polymer particles with low refractive index, low dielectric constant, lightweight, and thermal insulation.

Due to the presence of an air layer, it is possible to impart various properties (low refractive index, low dielectric constant, lightweight, thermal insulation). Available in sizes ranging from nano to micron.

It is a polymer microparticle with an air layer inside. By adding it to materials, it can impart properties of air, such as low refraction (low reflection) and low dielectric characteristics. Additionally, when added to resin, a hollow structure can also provide stress relaxation effects. The particle size can be provided in nano to micro sizes according to your requirements. *Please refer to the catalog available for download below for SEM images, features, and dielectric data.

Product HP【Tech Polymer Hollow Structure (TP-HS)】

basic information

Tech Polymer Hollow Polymer Microparticle Series These are hollow microparticles created by deepening Sekisui's unique polymerization technology. For inquiries regarding resin composition, particle size, and other physical properties, please contact us. For more details, please visit the Ipros link or contact us through our company website. Our company website: https://www.tech-p.com/products/#a-form1 【Related Words】Organic Microparticles / Polymer Microparticles / Fine Powders / Beads / Fillers / Powder

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Applications/Examples of results

Expected Applications Semiconductors, insulating materials, electronic components, 5G, low dielectric, high frequency, transmission loss reduction, millimeter-wave radar, resin modification, optical materials (low reflection, low refraction, wavelength permeability), adhesives - Insulating film materials for semiconductors compatible with 5G - Optical systems such as photolithography and low-reflection coatings - Providing flexibility to adhesives, imparting low dielectric properties, etc.

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