樹脂粒子(開発品)【テクポリマー】
樹脂粒子(開発品)【テクポリマー】
樹脂粒子【テクポリマー】で提案している開発品となります。
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Submicron-sized polymer particles, spherical, with a sharp particle size distribution.
These are spherical polymer microparticles composed of acrylic and styrene, with an average particle diameter adjusted in the range of 0.15μm to 1μm.
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High heat-resistant acrylic particles, light diffusion, matte finish, design enhancement, AB property addition.
These are spherical organic microparticles with excellent heat resistance. They can also be used in applications involving high-temperature resin mixing.
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Hydrophilic acrylic particles, water affinity enhancement, dispersion improvement.
Due to its good dispersibility in water, the workability is significantly improved when adding it to paints and inks that use water or highly polar solvents.
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Non-spherical acrylic polymer microparticles
These are non-spherical organic microparticles created from Sekisui's unique polymerization technology.
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Biomass microparticles
Spherical fine particles with excellent softness, composed of 40% biomass.
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Biodegradable microparticles (soil degradation)
Spherical microparticles with excellent soft material biodegradability.
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Hollow nanoacrylic particles solvent dispersion transparent low refractive index and low dielectric properties.
Nano-sized organic resin particles that possess an air layer, allowing for the impartation of various properties (low refractive index, low dielectric constant, lightweight, thermal insulation).
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Hollow polymer particles with low refractive index, low dielectric constant, lightweight, and thermal insulation.
Due to the presence of an air layer, it is possible to impart various properties (low refractive index, low dielectric constant, lightweight, thermal insulation). Available in sizes ranging from nano to micron.
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(Wavelength control technology) Acrylic-based microparticles
It is a polymer microparticle that can control the wavelength in a specific domain.
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PET micro-particles (TP-MG)
This is a micro-sized PET resin microparticle created from Sekisui's unique microparticle technology.
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Conductive polymer microparticles
These are polymer microparticles with conductivity imparted by Sekisui's unique particle technology.
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Disappearing acrylic binder ceramic sintered metal paste viscosity adjustment
Microspheres of methacrylic resin with excellent thermal decomposition characteristics under non-oxidizing atmosphere.
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Low dielectric resin filler for additives in semiconductor packaging and assembly materials.
It is a resin filler with low dielectric properties, an additive that meets the requirements of Dk 3.0 and Df 0.002 or lower for 5G and 6G.
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