Low dielectric resin filler for additives in semiconductor packaging and assembly materials.
It is a resin filler with low dielectric properties, an additive that meets the requirements of Dk 3.0 and Df 0.002 or lower for 5G and 6G.
We offer a lineup of hollow types (non-foamed) with excellent low dielectric constant and solid types that consider handling properties. 【Intended Applications】 Additives for materials in semiconductor packaging and mounting fields. 【Product Lineup】 Particle Structure: Hollow Type Particle Structure: Solid Type For information on composition, particle size, hollow ratio, apparent density, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Coarse particle cutting Hollow ratio adjustment Surface treatment Flame retardancy improvement
basic information
Low dielectric resin filler Tech Polymer has begun proposals for low dielectric applications aimed at reducing transmission loss in high-frequency regions. We are conducting product proposals leveraging our high customization capabilities, so please feel free to contact us if you are interested. For more details, please inquire through the Ipros link or our company website. (If you are contacting us through our website, please mention that you have viewed the product page on Ipros.) Our website: https://www.tech-p.com/ 【Related words】Organic microparticles / Polymer microparticles / Micronized powder / Beads / Filler / Powder / Dielectric constant / Dielectric loss tangent / Substrate / Copper-clad laminate
Price range
Delivery Time
Model number/Brand name
Tech Polymer
Applications/Examples of results
【Examples of Applicable Fields】 - Semiconductor packages - Mounting fields - Substrates - Copper-clad laminates, etc. 【Functionality Enhancement】 - Low dielectric - Flexibility, etc.
