[Technical Article] Case Studies on Solving Issues with Hollow Polymer Microparticles
Differentiating from competitors through the development of insulating film materials for semiconductors compatible with 5G! What are the customizable organic materials that achieve low dielectric properties?
5G, the next-generation mobile communication system, can transmit large volumes of data at high speeds. The development of low-dielectric semiconductors and substrates that suppress signal transmission loss in the high-frequency range is required. 【Key Issues】 We want to promote low-dielectric properties not only through resin modification but also with additives. We need additives that are compatible with the base resin and customizable. 【Solution Points】 Hollow polymer microparticles can impart low-dielectric properties due to the air layer inside the particles. They are lightweight and flexible, and customization of particle size, composition, and heat resistance is also possible. For more details, please check the link below.
basic information
Tech Polymer Hollow Polymer Microparticle Series These are hollow microparticles created by deepening Sekisui's unique polymerization technology. For inquiries regarding resin composition, particle size, and other physical properties, please contact us. For more details, please refer to the Ipros link or contact us through our company website. Our company website: https://www.tech-p.com/products/#a-form1 【Related Keywords】Organic Microparticles / Polymer Microparticles / Micronized Powders / Beads / Fillers / Powders
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Hollow polymer microparticles
Applications/Examples of results
Expected Applications Semiconductors, insulating materials, electronic components, 5G, low dielectric, high frequency, transmission loss reduction, millimeter-wave radar, resin modification, optical materials (low reflection, low refraction, wavelength transparency), adhesives - Insulating film materials for semiconductors compatible with 5G - Optical systems such as photolithography and low-reflection coatings - Providing flexibility to adhesives, imparting low dielectric properties, etc.
