Disassembly and analysis of the iPhone 18 Pro/Pro Max
An overview of the iPhone 18 Pro and Pro Max, from design to market impact.
This is the on-demand video of the Tech Insights webinar held recently. By registering on the site, you will be able to view it. It includes innovations in processors and modems, advancements in packaging, facts revealed through teardown investigations, and bill of materials (BOM) analysis. We will discuss the impact on pricing, procurement trends, and Apple’s evolving hardware strategy. Analysts will explain the market impact of the new iPhone, as well as the latest advancements in technology, packaging, connectivity, and system design, revealing the internal structure of the device through thorough teardowns. Ultimately, we examined the cost structure and supply chain trends that shape this flagship product. *Please note that as this is an early-stage analysis, some of the observations and estimates presented today are provisional and may change with the collection of additional data and verification of new insights.
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★ Wayne Lam, Chief Analyst for Device Technology, discusses market outlook and impact, connectivity, and system architecture. ★ Rajesh Krishnamurthy, Analyst and Technical Fellow, focuses on defining the logic behind the 20 Pro. ★ Cameron McKnight McNeill, Process Analyst, discusses advanced packaging surrounding the 18 Pro. ★ Stacey Wagner provides an overview of disassembly and components. ★ Al Kowski, Cost Analysis Manager, and Patrick Goffman, Strategic Sourcing and Purchasing Manager, explain cost calculation and procurement practices.
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Webinar video "Let's take a look inside the iPhone 18 Pro and Pro Max"
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The A20 Pro chip is the first commercial semiconductor to adopt TSMC's cutting-edge 2nm (GAA: Gate-All-Around) technology. Measuring the technological capabilities of competitors: Confirming internal layouts to infer die size (chip area), transistor density, and yield (good product rate). Benchmarking design philosophy: Analyzing Apple's new design intent of "placing memory horizontally rather than on top of the chip (advanced packaging developed in the M series)." For material and chemical manufacturers, this may be useful for forecasting demand for thermal design and advanced packaging materials. With the advent of the 2nm generation and the explosive increase in transistor density, "localized heat generation (thermal density)" in semiconductor packaging has become a significant challenge. Understanding trends in the adoption of new materials: Analyzing why Apple has completely shifted thermal design from traditional graphite sheets to "massive vapor chambers three times the area" and "metal cases for batteries (metal shells)."
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