We will be exhibiting at "JISSO PROTEC" within JPCA2025, which will be held at Tokyo Big Sight from June 4, 2025. Please be sure to stop by our booth when you visit. Booth Number: East Hall 4, 4A-03 【Exhibited Products】 - Manual Die Bonder / Flip Chip Bonder - Chip Mounter / Multi Die Bonder - Bond Tester - Electronic Circuit Printer - Area Laser Reflow System

Launched in 2022 as a higher model of the electronic circuit printer V-One. It is an electronic circuit printer for research and development in flexible electronics/stretchable electronics. It can perform wiring patterning on film substrates such as PET, polyimide, and TPU, greatly contributing to the research and development of new devices. In addition to real-time monitoring of dispense pressure using pressure sensors, NOVA also allows for alignment and printing verification through a camera module, which is a significant difference from V-One. Furthermore, there is a high degree of freedom in the types of liquids that can be specified, allowing for a wide range of inks and pastes to be used. Additionally, although there are some limitations, it is also possible to perform wiring on rigid substrates (such as FR1, FR4) and three-dimensional objects, in addition to film substrates.