Techno Vision Co., Ltd. is pleased to announce that we will be exhibiting at "SEMICON Japan 2024," which will be held at Tokyo Big Sight from December 11, 2024. This exhibition will gather semiconductor-related equipment in one place. This time, we will introduce devices related to the back-end processes of semiconductor manufacturing. We will also showcase new development products, so we look forward to your visit. SEMICON Japan 2024 Dates: December 11 (Wed) - 13 (Fri) Venue: Tokyo Big Sight Booth Number: [1034] East Hall 1 Main Exhibited Products ■ Spring Chuck Manual Mounting Device "FM-2248/2243" ■ UV Film Curing Device "UVC-512B" ■ Film Attachment Device Manual Mounting Device "FM-224 Series" ■ [Reference Exhibit] Film Expansion Device "EXM-200" We understand you may be busy, but we sincerely invite you to visit our booth.

Techno Vision Co., Ltd. is pleased to announce that we will be exhibiting at "SEMICON Japan 2023," which will be held at Tokyo Big Sight from December 13, 2023. At this exhibition, we will showcase products (concept models) aimed at contributing to the SDGs. The reference exhibits include a dicing frame used in the dicing process and a grip ring used during the expansion of chips/dies after dicing. Both products, made from new materials, are prototypes developed with the concept of contributing to plastic reduction and being environmentally friendly. In particular, the dicing frame is lightweight at 46g, which is less than one-third of the 154g of a stainless steel product. When comparing the weight of the dicing frame alone, which is 1,540kg for processing 10,000 wafers, the concept model weighs only 460kg, significantly contributing to the reduction of transportation costs. SEMICON Japan 2023 Dates: December 13 (Wed) - 15 (Fri) Booth Number: [7507] Hall 7 Location: Tokyo Big Sight