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A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.

■Main Features Vacuum Adhesion Method By performing adhesion in a vacuum, bubble inclusion is suppressed, achieving stable adhesion. High Reproducibility By numerically managing vacuum pressure and process time, variations caused by operators are reduced. Low Load Design for Wafers No excessive mechanical pressure is required, making it suitable for thin wafers and brittle substrates. Wide Material Compatibility Compatible with various substrates such as silicon, glass, and ceramics. Intuitive Operability Easy operation via a touch panel. Condition settings can be managed with a password. ■Main Specifications Frame Size: DTF2-8-1 Device Dimensions: 360mm(W) × 600mm(D) × 815mm(H) Weight: 29kg Required Vacuum Level (Absolute Pressure): 0.2 kPa Recommended Exhaust Speed: Approximately 320 L/min (19 m³/h) Required Air Pressure: 0.4 to 0.6 MPa Input Power Supply: AC100V 50/60Hz

A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.

■Main Features Equipped with a heated chuck By heating the attachment stage, the fluidity of the adhesive is controlled, stabilizing the attachment quality. Vacuum + Temperature Process Management Vacuum pressure, temperature, and time are numerically managed to achieve a highly reproducible process. Suppression of Attachment Irregularities and Bubbles Heating attachment in a vacuum environment reduces bubble inclusion and attachment irregularities. Compatible with a Wide Range of Tapes Supports various dicing tapes and protective tapes that require heating. ■Main Specifications Model: 【TV-200H】 【TV-300H】 Frame Size: DTF2-8-1 DTF2-12 Maximum Temperature: Up to 100°C Device Dimensions: 385mm(W)×600mm(D)×815mm(H) 470mm(W)×750mm(D)×893mm Weight: 40.4kg 43kg Required Vacuum Level (Absolute Pressure): 0.2 kPa Recommended Exhaust Rate: Approximately 320 L/min (19 m³/h) Required Air Pressure: 0.4–0.6 MPa Input Power: <Device Body> AC100V 50/60Hz X 1, <Temperature Controller> AC110V 50/60Hz X 2

TAIKO(R) wafer and thin wafer compatible models

■Main Features Membrane Attachment Method By transmitting pressure through a flexible membrane, it uniformly conforms to wafers with steps and curved surfaces. Radial Attachment By progressing the attachment from the center to the outer circumference, it reduces bubble inclusion and localized stress. Low Damage Design for Wafers It minimizes mechanical stress on the outer edge, reducing the risk of cracking or chipping for thin wafers and TAIKO(R) wafers. High Reproducibility with Vacuum Attachment By numerically managing vacuum pressure and process time, stable process reproducibility is ensured. ■Main Specifications Frame Size: DTF2-8-1 Device Dimensions: 360mm(W) × 600mm(D) × 815mm(H) Weight: 29kg Required Vacuum Level (Absolute Pressure): 0.2 kPa Recommended Exhaust Rate: Approximately 320 L/min (19 m³/h) Required Air Pressure: 0.4 to 0.6 MPa Input Power Supply: AC100V 50/60Hz

A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.

■Main Features TAIKO(R) Compatible Membrane Attachment Method Pressure is transmitted through a flexible membrane, allowing it to uniformly conform to wafers with steps and curved surfaces. Low Stress through Radial Attachment By progressing the attachment from the center to the outer circumference, stress concentration at the outer edge and air bubble inclusion are suppressed. Heated Chuck Equipped By heating the attachment stage, the fluidity of the adhesive tape is controlled, stabilizing the attachment quality. Integrated Management of Vacuum, Temperature, and Time Key process conditions are managed numerically, achieving high process reproducibility. ■Main Specifications Frame Size: DTF2-8-1 Maximum Temperature: Up to 100°C Device Dimensions: 360mm(W) × 600mm(D) × 815mm(H) Weight: 29kg Required Vacuum Level (Absolute Pressure): 0.2 kPa Recommended Exhaust Rate: Approximately 320 L/min (19 m³/h) Required Air Pressure: 0.4 to 0.6 MPa Input Power <Main Unit> AC100V 50/60Hz X 1 <Temperature Controller> AC110V 50/60Hz X 1