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[Case Study] Analysis of Additives in Nickel Sulfate Plating Solution by HPLC

HPLC method achieving high-sensitivity quantitative analysis without complex preprocessing: Introducing quantitative know-how for quality control.

In the quality control of plating solutions, the quantification of additives is an important factor. In particular, the quantification of sulfur-containing compounds that contribute to film quality adjustment and prevention of liquid decomposition is essential. This document provides accurate and highly reproducible analytical results using a method that does not require complex pretreatment. For the HPLC measurement conditions, an ion-pair reagent was added to the mobile phase, and an injection method was adopted to reduce the influence of sample impurities. As a result, sharp peaks can be obtained without being affected by metals and inorganic ions. Additionally, by comparing the chromatograms of the standard solution and the plating solution sample, it can be confirmed that the concentration of additives is maintained consistently. Furthermore, as an evaluation of reproducibility, the same sample was measured five times, demonstrating high reproducibility. 【Features】 ■ High-sensitivity quantitative analysis without complex pretreatment ■ High reproducibility using ion-pair reagents ■ Injection method that reduces the influence of metals and inorganic ions ■ Accurate quantification through comparison of standard solutions and actual samples ■ Highly reproducible analytical results

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【System Configuration】 Thermo Scientific Vanquish Core HPLC System - Pump: Thermo Scientific Vanquish Quaternary C - Autosampler: Thermo Scientific Vanquish Split Sampler CT - Column Oven: Thermo Scientific Vanquish Column Compartment C - Diode Array Detector: Thermo Scientific Vanquish DAD CG Software: Thermo Scientific Chromeleon Chromatography Data System 7.3

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Quantitative analysis of brighteners (saccharin and 2-butin-1,4-diol) in electrolytic nickel plating solution.

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Vanquish Core HPLC System

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Analysis of Additives in Plating Solutions by HPLC: Quantification and Analysis Points for Quality Control

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