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Vacuum Type Stirring and Defoaming Device | Awatori Rentaro ARV-501

Simultaneous mixing and submicron-level degassing. Processing information is reported every second, contributing to improved traceability.

The Awatori Nentaro ARV-501 is a mixer that enables stirring and bubble removal in a short time without overflow, thanks to its rotational and orbital motion combined with a vacuum decompression function. With its communication capabilities, it allows for operation and settings to be controlled from external devices such as PCs. Processing information can be recorded every second, contributing to improved traceability. The maximum load capacity (total of materials, containers, adapters, etc.) is 700g, making it suitable for stirring and defoaming materials that are prone to bubble formation, such as resins for injection molding and high-viscosity adhesives. 【Features】 ■ Improved stirring performance through increased orbital speed and optimization of the self-rotation ratio ■ Variable rotation speed allows for optimal settings according to material characteristics ■ Touch panel for easier condition setting ■ Inherits the highly durable drive unit of the ARE-500, tested in production environments ■ Added communication functions contribute to traceability management ■ Adapter manufacturing enables processing with various containers We also offer the "Awatori Nentaro ARV-310P" with a maximum load capacity of 310g.

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basic information

■Maximum load capacity / 700g *Total weight including materials, containers, adapters, etc. ■Standard container / 550mL resin container *Actual stirring amount may vary depending on the container, materials, and conditions, so please inquire. ■Power supply / Voltage: Single-phase AC200V–240V±10% (Note), 50/60Hz Power consumption: Approximately 50VA (standby), maximum 2000VA (excluding starting) (Note: The voltage when used with the separately sold pump unit PU-501 is single-phase AC200V±10%) ■Main body dimensions / H815 × W500 × D595 (mm)

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Model number/Brand name

Awatori Rentaro ARV-501

Applications/Examples of results

■Examples of Use Resin for Injection Molding Dam Material for Semiconductors High Viscosity Adhesive *For more details, please refer to the materials. Feel free to contact us as well.

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