Sonosys Corporation's Mega Sonic System (FTF Transducer)
Next-generation megasonic technology can instantly clear wafers up to 300mm.
The SONOSYS 1MHz megasonic system (FTF transducer & MGH generator) is a high-performance system designed to optimize the cleaning process of single substrates. The main features are as follows: - High-precision cleaning: The PFA-sealed transducer is installed approximately 1.5mm from the substrate, delivering megasonic energy uniformly. - Patent technology: Utilizing "butterfly piezoelectric ceramic" technology, it achieves up to 40% higher sound pressure and up to 30% higher efficiency compared to conventional systems. - Single process compatibility: Suitable for cleaning substrates or wafers up to 300mm. - High output specifications: Features an output adjustment range of 150W (approximately 20% to 100%) and utilizes 1MHz ultrasound. - Stable operating environment: The enclosure is a compact 19-inch design. - Operating temperature range is +10°C to +40°C. - Durability and adaptability: Capable of handling liquid temperatures up to +80°C (when using nitrogen cooling). - PTFE-coated coaxial HF cable (3m) included. - Precision design: Installation distance is approximately 1.5mm (at 1MHz), with a minimum liquid layer thickness of approximately 4mm on the substrate.
basic information
Modular Mega Sonic Generator (150W) - Output Power: 150W - Output Adjustment Range: Approximately 20% to 100% - Frequency: 1MHz - Power Supply Voltage: 230VAC, 50-60Hz - Enclosure: 19-inch enclosure (3/4U) - Dimensions: 28HP; 165×185×329mm (WxHxD) - Weight: Approximately 4.5kg - Operating Temperature Range: +10℃ to +40℃ (to prevent condensation) FTF Transducer - Dimensions: Approximately 164×50×34mm - Material: PFA - Transducer Element: Special PZT piezoelectric ceramic (butterfly technology) - Conversion Area: Approximately 150×25mm - Output: 150W / 1MHz - HF Cable: PTFE coated coaxial HF cable (total length 3m, of which 0.8m is from the transducer to the matching box)
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Model number/Brand name
Sonosys
Applications/Examples of results
Usage and Specific Processes Wafer Cleaning - Capable of single-process cleaning for wafers up to 300mm - A PFA sealed transducer is installed approximately 1.5mm from the wafer to transmit high-efficiency and uniform acoustic energy - Retaining a liquid layer to remove fine foreign substances and particles Photomask Cleaning - Removes dirt from photomasks used in the lithography process of semiconductor manufacturing, maintaining pattern accuracy - Achieves more effective cleaning with up to 40% higher sound pressure compared to conventional systems using "butterfly piezoelectric ceramic" technology Cleaning of MEMS Devices - Applicable to the cleaning of MEMS (Micro-Electro-Mechanical Systems) products using microfabrication technology - Non-contact megasonic cleaning minimizes device damage while removing dirt from precision structures Removal of Microparticles from Display Panels and IC Substrates - Cleaning prior to surface treatment of liquid crystal displays, printed circuit boards (PCBs), and IC substrates - Effective removal of microparticles using 1MHz high-frequency ultrasound, improving manufacturing quality
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Announcement of the release of the latest leaflet for the SONOSYS Corporation's megasonic cleaning device.
We have updated the product leaflet for the SONOSYS megasonic cleaning device from Germany to the latest version. SONOSYS's megasonic cleaning technology is a non-contact precision cleaning technique that efficiently removes fine particles by transmitting high-frequency ultrasonic energy through liquids such as pure water (DI Water) to the surface of the target object. It is particularly suitable for the precision cleaning of products with fine structures, such as semiconductor wafers, photomasks, MEMS, various substrates, and optical components, and is utilized in various fields that require high cleanliness, starting with semiconductor manufacturing processes. SONOSYS offers a range of frequencies depending on the application and the particles to be removed, as well as a megasonic nozzle system that accommodates various cleaning conditions, including Single Nozzle, Dual Nozzle, and Triple Nozzle. Customers who have challenges such as "wanting to remove fine particles from wafers," "wanting to clean photomasks and MEMS while minimizing damage," or "wanting to review existing cleaning processes" are encouraged to take a look at the latest leaflet.
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The NHK program "The Wall of Truth" will feature a video of semiconductor wafer cleaning provided by our company.
We are pleased to announce that a video provided by Tick Corporation showcasing semiconductor wafer cleaning will be featured in the NHK program "The Wall of Truth." The theme for this episode is "The Truth of Water (tentative)." The program is scheduled to briefly introduce the process of cleaning wafers with pure water during semiconductor manufacturing. Our company offers cleaning and spraying technologies, including megasonic cleaning, for the semiconductor and electronic components sectors. We are truly honored that our footage will be utilized in the production of this NHK program. Broadcast schedule: September 12, 2026 (Saturday) from 8:30 PM to 8:59 PM (tentative). For more details about the program, please visit the official NHK "The Wall of Truth" page. https://www.nhk.jp/g/ts/N8JX1V6V69/ *Please note that the broadcast date and content may be subject to change.
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Our company's handled products, including air nozzles and tank cleaning nozzles from Rehlar, ultrasonic spray nozzles from Sonia, and blowers and air knives (drying devices) from Sonic, have been featured on the industrial product and manufacturer comparison site "Metory."
We are pleased to announce that our company's handled products, including air nozzles from Rehlar, tank cleaning nozzles, ultrasonic spray nozzles from Sonia, and blowers and air knives (drying devices) from Sonic, have been featured on the industrial product and manufacturer comparison site "Metoree." About "Metoree" Metoree is a comparison site for industrial product manufacturers aimed at engineers, researchers, and purchasing professionals. It provides useful information to help engineers easily compare and select products and manufacturers.
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Tick Corporation is committed to providing products that contribute to solving various issues faced by companies, such as improving production efficiency, enhancing cost efficiency, improving quality, and considering environmental conservation. We have been widely collecting product information from around the world and providing products that meet market needs. In the future, we will continue to develop and deliver products that contribute to rationalization and particularly to environmental conservation, which has become increasingly stringent in recent years. ◇◆Main Products◇◆ - Precision industrial spray nozzles - Agricultural spray nozzles - Air nozzles / Air knives - Special spray nozzles - Tank cleaning nozzles - Blowers - Ultrasonic spray nozzles (Nebulizers / Atomizers) - Ultrasonic cleaning devices - Air conveying devices - Ventilators - Plastic connectors - Cutting torches (nozzles for gas cutters) - Latex testers - In-house manufactured tubing pumps (dispensers) - Syringe pumps










