Ultrasonic Megasonic Cleaning Equipment for Semiconductor Wafers
Sonosys's ultrasonic cleaning solves the challenges of wafer cleaning.
In the semiconductor industry, particularly in wafer manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yields. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield
basic information
【Features】 ≪Ultra-Precision High-Frequency Megasonic Cleaning Spray Nozzle≫ - Diverse cleaning needs addressed through combinations of single, dual, and triple channel nozzles and frequencies - Megasonic immersion-type transducer operating from 400kHz to 9MHz ≪Ultra-Precision High-Frequency Megasonic Immersion Cleaning System≫ - Stainless steel or plastic transducers - Compatible with 4", 6", and 8" substrate sizes - Improved cost-effectiveness through bath-tank cleaning 【Our Strengths】 Tick Corporation focuses on providing products that meet our customers' needs. With years of experience and a wide range of product offerings, we propose optimal cleaning solutions.
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Model number/Brand name
Sonosys
Applications/Examples of results
Single Wafer Cleaning Systems Applications • Non-contact cleaning of single substrates • High-precision particle removal • Megasonic cleaning using pure water as the medium • High-purity cleaning of semiconductor and optical components Examples • Introduced as custom cleaning equipment with single, dual, and triple nozzle configurations to semiconductor manufacturers Megasonic Cleaning Nozzles Applications • Single wafer cleaning • Photomask cleaning • Non-contact cleaning of MEMS and microstructures • Lift-off process • Improved chemical cleaning efficiency in semiconductor front-end processes • Energy-saving in wet bench processes (reduction of chemicals and electricity) Examples • Adopted worldwide as semiconductor front-end cleaning equipment using high-frequency megasonics from 400kHz to 9MHz • Used by MEMS manufacturers as a cleaning solution that minimizes damage to fine micro and nano structures
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[Exhibition Information] SONOSYS from Germany will exhibit at "SEMICON Japan 2026".
We are pleased to announce that SONOSYS, a German manufacturer represented by our company, will be exhibiting at "SEMICON Japan 2026," which will be held at Tokyo Big Sight, utilizing the "EU Business Hub" program to support EU companies entering the Japanese market. SONOSYS provides megasonic cleaning technology suitable for cleaning processes of semiconductor wafers, MEMS, and precision electronic components. At this exhibition, representatives from SONOSYS will be visiting Japan from Germany to introduce their megasonic cleaning technology. 【Exhibition Overview】 Exhibition Name: SEMICON Japan 2026 Dates: December 9 (Wednesday) - 11 (Friday), 2026 Venue: Tokyo Big Sight Exhibiting Company: SONOSYS (Germany) Participation Program: EU Business Hub Booth Number: Details will be provided as soon as they are finalized. If you are interested in the removal of fine particles in semiconductor manufacturing processes or reducing damage during cleaning, please take this opportunity to see SONOSYS's technology. Our company is also collaborating with SONOSYS to provide consultations regarding megasonic cleaning technology.
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Announcement of the product page launch for the SONOSYS Megasonic Cleaning Nozzle System | Precision Cleaning for Semiconductors and MEMS
We are pleased to announce that Tick Corporation has launched a product introduction page for the SONOSYS megasonic cleaning nozzle system. The megasonic cleaning technology from SONOSYS utilizes high-frequency energy ranging from 600 kHz to 9 MHz to precisely remove fine particles while minimizing damage to microstructures such as semiconductor wafers, photomasks, and MEMS. The new page features the characteristics of single, double, and triple nozzles, as well as applications for semiconductors, MEMS, optical components, and LCD/FPD substrates. If you are considering fine particle removal, precision cleaning using ultra-pure water (DI Water), or megasonic cleaning at frequencies such as 600 kHz or 1 MHz, please take a look.
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Announcement of the release of the latest leaflet for the SONOSYS Corporation's megasonic cleaning device.
We have updated the product leaflet for the SONOSYS megasonic cleaning device from Germany to the latest version. SONOSYS's megasonic cleaning technology is a non-contact precision cleaning technique that efficiently removes fine particles by transmitting high-frequency ultrasonic energy through liquids such as pure water (DI Water) to the surface of the target object. It is particularly suitable for the precision cleaning of products with fine structures, such as semiconductor wafers, photomasks, MEMS, various substrates, and optical components, and is utilized in various fields that require high cleanliness, starting with semiconductor manufacturing processes. SONOSYS offers a range of frequencies depending on the application and the particles to be removed, as well as a megasonic nozzle system that accommodates various cleaning conditions, including Single Nozzle, Dual Nozzle, and Triple Nozzle. Customers who have challenges such as "wanting to remove fine particles from wafers," "wanting to clean photomasks and MEMS while minimizing damage," or "wanting to review existing cleaning processes" are encouraged to take a look at the latest leaflet.
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Tick Corporation is committed to providing products that contribute to solving various issues faced by companies, such as improving production efficiency, enhancing cost efficiency, improving quality, and considering environmental conservation. We have been widely collecting product information from around the world and providing products that meet market needs. In the future, we will continue to develop and deliver products that contribute to rationalization and particularly to environmental conservation, which has become increasingly stringent in recent years. ◇◆Main Products◇◆ - Precision industrial spray nozzles - Agricultural spray nozzles - Air nozzles / Air knives - Special spray nozzles - Tank cleaning nozzles - Blowers - Ultrasonic spray nozzles (Nebulizers / Atomizers) - Ultrasonic cleaning devices - Air conveying devices - Ventilators - Plastic connectors - Cutting torches (nozzles for gas cutters) - Latex testers - In-house manufactured tubing pumps (dispensers) - Syringe pumps