Ultrasonic Megasonic Cleaning Equipment for Semiconductor Wafers
Thorough removal of fine contaminants from wafers. High-quality cleaning achieved by Sonosys.
In the semiconductor industry, particularly in wafer manufacturing, the removal of fine contaminants is a critical issue that affects product quality. Fine particles and organic substances adhering to the wafer surface can lead to decreased device performance and lower yields. Our ultrasonic megasonic cleaning equipment effectively removes these contaminants from the wafer surface using megasonic technology. This supports the production of high-quality semiconductor products. 【Usage Scenarios】 - Cleaning in the wafer manufacturing process - Removal of fine contaminants and organic substances - Production of high-quality semiconductor products 【Benefits of Implementation】 - Improved cleaning quality - Enhanced yield - Increased product reliability
basic information
【Features】 - High-efficiency cleaning with a megasonic nozzle - Wide frequency range from 400 kHz to 9 MHz - Flexible response with immersion-type transducers - Improved cost-effectiveness through bath and tank cleaning - Stainless steel or plastic transducers 【Our Strengths】 Tick Corporation is committed to providing products that meet our customers' needs, offering a wide range of products. In addition to ultrasonic cleaning devices, we can also provide various related products.
Price range
Delivery Time
Model number/Brand name
Sonosys
Applications/Examples of results
Cleaning of semiconductor wafers, photomasks, and MEMS.
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[Exhibition Information] SONOSYS from Germany will exhibit at "SEMICON Japan 2026".
We are pleased to announce that SONOSYS, a German manufacturer represented by our company, will be exhibiting at "SEMICON Japan 2026," which will be held at Tokyo Big Sight, utilizing the "EU Business Hub" program to support EU companies entering the Japanese market. SONOSYS provides megasonic cleaning technology suitable for cleaning processes of semiconductor wafers, MEMS, and precision electronic components. At this exhibition, representatives from SONOSYS will be visiting Japan from Germany to introduce their megasonic cleaning technology. 【Exhibition Overview】 Exhibition Name: SEMICON Japan 2026 Dates: December 9 (Wednesday) - 11 (Friday), 2026 Venue: Tokyo Big Sight Exhibiting Company: SONOSYS (Germany) Participation Program: EU Business Hub Booth Number: Details will be provided as soon as they are finalized. If you are interested in the removal of fine particles in semiconductor manufacturing processes or reducing damage during cleaning, please take this opportunity to see SONOSYS's technology. Our company is also collaborating with SONOSYS to provide consultations regarding megasonic cleaning technology.
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Announcement of the product page launch for the SONOSYS Megasonic Cleaning Nozzle System | Precision Cleaning for Semiconductors and MEMS
We are pleased to announce that Tick Corporation has launched a product introduction page for the SONOSYS megasonic cleaning nozzle system. The megasonic cleaning technology from SONOSYS utilizes high-frequency energy ranging from 600 kHz to 9 MHz to precisely remove fine particles while minimizing damage to microstructures such as semiconductor wafers, photomasks, and MEMS. The new page features the characteristics of single, double, and triple nozzles, as well as applications for semiconductors, MEMS, optical components, and LCD/FPD substrates. If you are considering fine particle removal, precision cleaning using ultra-pure water (DI Water), or megasonic cleaning at frequencies such as 600 kHz or 1 MHz, please take a look.
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Announcement of the release of the latest leaflet for the SONOSYS Corporation's megasonic cleaning device.
We have updated the product leaflet for the SONOSYS megasonic cleaning device from Germany to the latest version. SONOSYS's megasonic cleaning technology is a non-contact precision cleaning technique that efficiently removes fine particles by transmitting high-frequency ultrasonic energy through liquids such as pure water (DI Water) to the surface of the target object. It is particularly suitable for the precision cleaning of products with fine structures, such as semiconductor wafers, photomasks, MEMS, various substrates, and optical components, and is utilized in various fields that require high cleanliness, starting with semiconductor manufacturing processes. SONOSYS offers a range of frequencies depending on the application and the particles to be removed, as well as a megasonic nozzle system that accommodates various cleaning conditions, including Single Nozzle, Dual Nozzle, and Triple Nozzle. Customers who have challenges such as "wanting to remove fine particles from wafers," "wanting to clean photomasks and MEMS while minimizing damage," or "wanting to review existing cleaning processes" are encouraged to take a look at the latest leaflet.
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Tick Corporation is committed to providing products that contribute to solving various issues faced by companies, such as improving production efficiency, enhancing cost efficiency, improving quality, and considering environmental conservation. We have been widely collecting product information from around the world and providing products that meet market needs. In the future, we will continue to develop and deliver products that contribute to rationalization and particularly to environmental conservation, which has become increasingly stringent in recent years. ◇◆Main Products◇◆ - Precision industrial spray nozzles - Agricultural spray nozzles - Air nozzles / Air knives - Special spray nozzles - Tank cleaning nozzles - Blowers - Ultrasonic spray nozzles (Nebulizers / Atomizers) - Ultrasonic cleaning devices - Air conveying devices - Ventilators - Plastic connectors - Cutting torches (nozzles for gas cutters) - Latex testers - In-house manufactured tubing pumps (dispensers) - Syringe pumps