Ultrasonic Megasonic Cleaning Device for Optical Lens Manufacturing
Precision cleaning of optical lenses with Sonosys ultrasonic cleaning.
In optical lens manufacturing, the removal of fine foreign substances and residues is a crucial issue that affects product quality. Even slight dirt on the lens surface can lead to a decline in device performance and a deterioration in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in optical lens manufacturing. 【Application Scenarios】 - Removal of foreign substances in the optical lens manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Effects of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield
basic information
【Features】 ≪Ultra-Precision High-Frequency Megasonic Cleaning Spray Nozzle≫ - Diverse cleaning needs addressed through combinations of single, dual, and triple channel nozzles and frequencies - Megasonic immersion-type transducers ranging from 400kHz to 9MHz ≪Ultra-Precision High-Frequency Megasonic Immersion Cleaning System≫ - Stainless steel or plastic transducers - Compatible with 4", 6", and 8" substrate sizes - Improved cost-effectiveness through bath tank cleaning 【Our Strengths】 Tick Corporation focuses on providing products that meet customer needs. With years of experience and a wide range of product offerings, we propose optimal cleaning solutions.
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Model number/Brand name
Sonosys
Applications/Examples of results
Single Wafer Cleaning Systems Applications • Non-contact cleaning of single substrates • High-precision particle removal • Megasonic cleaning using pure water as the medium • High-purity cleaning of semiconductor and optical components Examples • Introduced as custom cleaning equipment with single, dual, and triple nozzle configurations to semiconductor manufacturers Megasonic Cleaning Nozzles Applications • Single wafer cleaning • Photomask cleaning • Non-contact cleaning of MEMS and microstructures • Lift-off process • Improved chemical cleaning efficiency in semiconductor front-end processes • Energy-saving in wet bench processes (reduction of chemicals and electricity) Examples • Adopted worldwide as semiconductor front-end cleaning equipment using high-frequency megasonics from 400kHz to 9MHz • Used by MEMS manufacturers as a cleaning solution that minimizes damage to fine micro and nano structures
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News about this product（2）
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Announcement of the release of the latest leaflet for the SONOSYS Corporation's megasonic cleaning device.
We have updated the product leaflet for the SONOSYS megasonic cleaning device from Germany to the latest version. SONOSYS's megasonic cleaning technology is a non-contact precision cleaning technique that efficiently removes fine particles by transmitting high-frequency ultrasonic energy through liquids such as pure water (DI Water) to the surface of the target object. It is particularly suitable for the precision cleaning of products with fine structures, such as semiconductor wafers, photomasks, MEMS, various substrates, and optical components, and is utilized in various fields that require high cleanliness, starting with semiconductor manufacturing processes. SONOSYS offers a range of frequencies depending on the application and the particles to be removed, as well as a megasonic nozzle system that accommodates various cleaning conditions, including Single Nozzle, Dual Nozzle, and Triple Nozzle. Customers who have challenges such as "wanting to remove fine particles from wafers," "wanting to clean photomasks and MEMS while minimizing damage," or "wanting to review existing cleaning processes" are encouraged to take a look at the latest leaflet.
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The NHK program "The Wall of Truth" will feature a video of semiconductor wafer cleaning provided by our company.
We are pleased to announce that a video provided by Tick Corporation showcasing semiconductor wafer cleaning will be featured in the NHK program "The Wall of Truth." The theme for this episode is "The Truth of Water (tentative)." The program is scheduled to briefly introduce the process of cleaning wafers with pure water during semiconductor manufacturing. Our company offers cleaning and spraying technologies, including megasonic cleaning, for the semiconductor and electronic components sectors. We are truly honored that our footage will be utilized in the production of this NHK program. Broadcast schedule: September 12, 2026 (Saturday) from 8:30 PM to 8:59 PM (tentative). For more details about the program, please visit the official NHK "The Wall of Truth" page. https://www.nhk.jp/g/ts/N8JX1V6V69/ *Please note that the broadcast date and content may be subject to change.
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Tick Corporation is committed to providing products that contribute to solving various issues faced by companies, such as improving production efficiency, enhancing cost efficiency, improving quality, and considering environmental conservation. We have been widely collecting product information from around the world and providing products that meet market needs. In the future, we will continue to develop and deliver products that contribute to rationalization and particularly to environmental conservation, which has become increasingly stringent in recent years. ◇◆Main Products◇◆ - Precision industrial spray nozzles - Agricultural spray nozzles - Air nozzles / Air knives - Special spray nozzles - Tank cleaning nozzles - Blowers - Ultrasonic spray nozzles (Nebulizers / Atomizers) - Ultrasonic cleaning devices - Air conveying devices - Ventilators - Plastic connectors - Cutting torches (nozzles for gas cutters) - Latex testers - In-house manufactured tubing pumps (dispensers) - Syringe pumps