High insulation and heat resistance "High-Insulation Adhesive Tape iCas HIT Series"
Thermal adhesive film with a proven track record for semiconductor applications. Features include high insulating properties and heat resistance, making it suitable for ensuring insulation around IC chips
This is a thermal adhesive film developed with our own high-insulation adhesive applied to a Polyimide Film. Featuring high electrical insulation and heat resistance, it ensures insulation even in environments where large currents and high voltages are present. It also offers excellent migration resistance and has a long track record of use in semiconductor applications. [Application] - Enables insulation between IC chips, and between lead frames and IC chips - Joins lead frames and heat sinks - Fixes and insulates electrical/electronic components, precision parts, devices, and jigs
basic information
As this product is still under development, technical data such as breakdown voltage and thermal resistance are not disclosed. For further details, please contact us via the inquiry form.
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Applications/Examples of results
- Enables insulation between IC chips, and between lead frames and IC chips - Joins lead frames and heat sinks - Fixes and insulates electrical/electronic components, precision parts, devices, and jigs
