Bakagawa Corporation is pleased to announce that the various physical properties and effectiveness of resource circulation of our cellulose fiber high-content resin "Green Chip CMF" have been validated in the Environmental Technology Verification (ETV) program conducted by the Ministry of the Environment. The results of this verification are published in the database of the Ministry of the Environment's ETV program. This product is a composite resin that incorporates a high content of cellulose fiber derived from wood into polypropylene (PP) resin, and it is expected to achieve a reduction in the use of petroleum-derived resins while promoting resource circulation. To objectively confirm the performance (physical properties) as a plastic resin and its material recyclability, it was adopted as a verification target technology in the Ministry of the Environment's ETV program (Resource Circulation Technology Domain), and verification was conducted by a third-party organization. The verification confirmed that, compared to standard PP resin, it demonstrated high performance in key physical properties and met the verification criteria. It was also confirmed that the rate of change in physical properties during material recycling remained within a certain range, demonstrating its effectiveness from the perspective of resource circulation.

We are pleased to announce that the "Flexible Surface Heater iCas MHE" from Hakawa Corporation has been demonstrated to have over 20% energy-saving performance compared to conventional mantle heaters in the Environmental Technology Verification (ETV) project conducted by the Ministry of the Environment. In the technical verification tests, a reduction of approximately 42% has been confirmed*. This product takes advantage of its ability to heat in close contact with the heated object, enabling efficient heat transfer compared to conventional heaters, and is expected to contribute to reducing environmental impact. To objectively evaluate this feature, the product was selected as a verification target technology under the Ministry of the Environment's ETV project, and verification was conducted by a third-party organization. During the verification, measurements of power consumption and other factors were taken under conditions simulating actual operation, confirming that the characteristic of heating in close contact with the heated object allows for efficient transmission of heating energy. Additionally, it was demonstrated that the entire surface generates heat uniformly, enabling stable heating with minimal temperature differences throughout the piping. *Refer to the Ministry of the Environment ETV project website for the list of verified technologies, verification reports, and summaries.

The breathable heater component "iCas MCT," developed by Hakusen Corporation, has been adopted in Nikon Corporation's semiconductor exposure equipment. This equipment is scheduled to be sold starting in December 2026. Semiconductor exposure equipment requires technology that can form complex and fine electronic circuit patterns on silicon wafers with high precision while also contributing to improvements in productivity and energy efficiency. Even slight temperature fluctuations can affect pattern accuracy, making high-precision and rapid temperature control in the exposure equipment essential, measured in mK (milliKelvin) units. The breathable heater component "iCas MCT" has been adopted for the first time in semiconductor exposure equipment. The "iCas MCT" is a heater component that uses a paper-like, porous structure made of "stainless steel fiber sheet" as the heating element. By incorporating breathability into the heater component and allowing air to pass vertically through the heating surface, it effectively heats while minimizing thermal capacity, achieving high temperature responsiveness and heating performance. Additionally, it contributes to the miniaturization and lightweight design of components, as well as the high performance of semiconductor exposure equipment.

Bashikawa Corporation (hereinafter referred to as "our company") will exhibit at the "101st Tokyo International Gift Show Spring 2026 Ethical Style Fair" to be held at Tokyo Big Sight from February 4 (Wednesday) to February 6 (Friday), 2026. The Tokyo International Gift Show is Japan's largest international trade fair for personal gifts and lifestyle goods. We will showcase products made with cellulose fiber blended resin "Green Chip CMF" and sustainable paper picnic tableware "Nogakel," among others, at the booth of the Osaka Prefecture / Osaka Bioplastics Business Promotion Network. ≪Nogakel Homepage≫ https://www.nogakel.com/ We sincerely look forward to your visit. *Advance registration is required for attendance.

From February 17 (Tuesday) to 20 (Friday), 2026, we will be exhibiting jointly with FP Kasei Co., Ltd. at HCJ2026 "International Hotel and Restaurant Show" held at Tokyo Big Sight. HCJ2026 is one of Japan's largest business negotiation exhibitions aimed at the "service industry" and "food business." At our joint exhibition booth, we will introduce the tableware "Mawal," made with cellulose fiber blended resin "Green Chip CMF." "Mawal" is a lifestyle brand that offers a non-disposable, circular ecosystem. ≪Mawal HP≫ https://mawal.jp/ We sincerely look forward to your visit. *Advance registration is required for attendance.

We will be exhibit at "Neo Functional Material 2026," which will be held from Wednesday, January 28 to Friday, January 30, 2026. We look forward to seeing you at our booth. [Exhibited Products] -Gap-free, flexible radiation shielding material "Tungsten Powder Holding Sheet" -Durable lightweight sheet material for harsh environments "Stainless Fiber Sheet Filter" -The "snap-in" structure streamlines the installation of heaters on small-diameter pipes "Half-split Heater for Small-diameter Pipes" -Thin and strong adhesion, available from 5µm "Thermo-setting Electrical Insulation Film SJ41" -Improved sealing performance for insert materials "Sealing Tape HT56 for Insert Molding"

Our company exhibited at the 5th Sustainable Material Exhibition during the High-Performance Material Week held from November 12 (Wednesday) to 14 (Friday), 2025. We showcased products that create new business value, primarily featuring the cellulose fiber high-content resin "Green Chip CMF," along with non-combustible and insulating sheets, and products using natural raw materials from our group company, NichiRica. We sincerely thank everyone who visited our booth. Through the display of molded products, "Green Chip CMF" effectively communicated its design and functionality, receiving positive feedback. Additionally, we received specific inquiries regarding thickness adjustments and fire resistance/insulation performance for the non-combustible and insulating sheets, along with numerous requests for sample provision. Furthermore, we exhibited existing NichiRica products along with two new development items. The development items were very well received, and we feel that the possibilities for new applications have expanded. In addition to the exhibited products, we will continue to respond to various needs by utilizing our formulation development technology, evaluation technology, and processing technology while co-creating with our customers.

We will exhibit at SEMICON Japan 2025 from Dec. 17 (Wed) to 19 (Fri), 2025. We look forward to seeing you at our booth. [Exhibited Products] - Performs reliably in environments up to 350℃ "350℃ Heat-resistant Removable Electrical Insulating Adhesive Tape" - Achives 25% energy savings compared to glass wool products "High-performance Insulation Sheet & Insulation Jackets" - The "snap-in" structure streamlines the instllation of heaters on small-diameter pipes "Half-spilt Heater for Small-diameter Pipes" - Heater + insulation with a total thickness as thin as 3mm "Thin-layer Heater for Flat Surfaces"

We will exhibit at Highly-functional Material Week – 5th Sustainable Material Expo from Nov. 12 (Wed) - 14 (Fri), 2025. We look forward to seeing you at our booth. [Exhibited Products] - Biomass compound resin containing wood-derived cellulose fiber 'GREEN CHIP CMF' - Thin, flexible thermal and fire barrier sheet 'Ceramic Fiber Sheet' 'Thermal Barrier / Flame Spread Prevention Sheet' - Composite of PET fiber, wood pulp, and functional materials​ 'Conversion Sheet‘ -'RICA TAPE', 'Kraft Paper Thermal Transfer Linerless Labels (Starch Adhesive)', 'Heat-Activated Kraft Paper Tape (Starch Adhesive)'

Hakusui Corporation (hereinafter referred to as "our company") will jointly exhibit with FP Chemical Industry Co., Ltd. and Kumi Chemical Co., Ltd. at the "Fujinokuni Cellulose Circular Economy International Exhibition" held in Fuji City from October 16 (Thursday) to October 17 (Friday), 2025. This exhibition will showcase products utilizing environmentally friendly cellulose materials derived from plants, and at our joint exhibition booth, you will be able to see examples of the resin "Green Chip® CMF®" with a high content of cellulose fibers and its application development. We look forward to your participation. *Advance registration is required.