Dry Pest Control Device (MAK Series)
We safely treat harmful exhaust gases emitted from devices that cannot release them into the atmosphere. We also design treatment agents based on on-site analysis of exhaust gas components.
The dry-type pest control device "MAK Series" reacts harmful components in exhaust gas with the chemical treatment agent Tomclean, converting them into safe compounds that are then fixed within the treatment agent and processed as industrial waste by our company. By selecting Tomclean according to the target components, it can accommodate a wide variety of exhaust gases.
basic information
【Wide Range of Compatibility】 Various processing agents are available, allowing for the selection of the most suitable agent for exhaust gases from different processes. Additionally, on-site analysis at our Yokohama Research Institute enables the design of processing agents based on field exhaust analysis results. 【Low Pressure Loss】 We adopt a processing agent filling method that minimizes pressure loss, controlling the pressure loss within the device to 0.1 KPa or less. This eliminates the need for dedicated exhaust blowers, reducing running costs. 【Manageability】 By automatically switching the sampling position of the agent breakthrough detector (break monitor), we can accurately manage the timing for agent replacement. 【Safety】 - The materials used for exhaust gas components are selected considering the target gas and reaction temperature. - If fixed by-products are mixed in the exhaust gas, they can be removed using a bag filter. - Full-bore type valves are used in the exhaust gas treatment line, making it less likely for blockages to occur within the device. - In addition to detecting agent breakthrough, we continuously monitor internal pressure, agent temperature, and other parameters, issuing alarms in the event of abnormalities. (Some features are optional)
Price range
Delivery Time
Applications/Examples of results
The following devices and gas types are supported. Ion implantation device: AsH3, PH3, BF3 CVD device: NH3, TiCl4, SiH2Cl2, WF6, SiF4, HCl, HF, F2, TEOS, CO, SiH4, PH3, AsH3, B2H6 Etching device: BCl3, HCl, HBr, F2, SiF4, WF6, Cl2, BCl3, HBr Chamber cleaning: HF, F2, SiF4, COF2, OF2 For gases not listed above, please contact us.
Line up（5）
| Model number | overview |
|---|---|
| MAK-025 | Maximum flow rate 40(L/min) |
| MAK-040 | Maximum flow rate 60(L/min) |
| MAK-060 | Maximum flow rate 90(L/min) |
| MAK-100 | Maximum flow rate 120(L/min) |
| MAK-550 | Maximum flow rate 250(L/min) |
